Multi-Die Stacked Memory Output Synchronization via Shared SYNC_PAD
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Solution Overview
Problem
Existing multi-die stacked memory technologies face issues with output synchronization, leading to potential short circuits and die malfunction due to inconsistent die performance, requiring complex host compatibility and synchronization mechanisms.
Innovation Solution
A multi-die stacked package memory design where dies share a CS# pin and an IO pin, with each die having a SYNC_PAD pin, and all SYNC_PAD pins are connected to ensure synchronized output through transistor and pull-up resistor circuits, allowing the system to output a unified busy or idle status signal based on die status.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple dies use the same chip selection signal and are operated as the same die, then the host compatibility is improved and no obvious difference exists in user experience, but the output synchronization requirements become higher and output contradictions may occur
Solution Approach 1:
The patent merges the chip selection functionality by connecting all dies to a common CS# pin, allowing the host to access multiple dies through a single selection signal. This improves adaptability by making the stacked package compatible with single-die access protocols. However, this merging creates the technical contradiction by requiring complex output synchronization mechanisms to prevent conflicts when multiple dies respond simultaneously.
Solution Approach 2:
The patent introduces an intermediary output synchronization mechanism that mediates between multiple dies sharing the same CS# pin. This intermediary controls the timing and coordination of outputs from different dies, ensuring they do not conflict. The synchronization mechanism acts as a buffer or coordinator that allows multiple dies to share the common selection signal while maintaining reliable operation.
2Productivity
If multiple dies have different working efficiencies, then the die performance varies, but output contradictions occur and dies may be burnt out without synchronization
Solution Approach 1:
The patent applies preliminary action by implementing output synchronization mechanisms before the dies can produce conflicting outputs. The synchronization system prepares and coordinates the timing of die operations in advance, ensuring that even though dies have different working efficiencies, their outputs are synchronized to prevent contradictions and potential damage.
3Quantity of substance
If multiple dies are stacked and packaged together with shared signals, then the integration density is improved, but the synchronization complexity increases
Solution Approach 1:
The patent merges multiple dies into a compact stacked package structure, increasing integration density by vertically stacking dies rather than placing them side-by-side. This spatial merging allows more dies to be packaged in a smaller footprint. However, this increased density creates the contradiction by requiring more complex synchronization mechanisms to coordinate the closely packed dies that share common control signals.
Data Source
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AI summary
The invention provides a multi-die stacked package memory and an output synchronization method thereof. The multi-die stacked package memory includes multiple dies (100), and the multiple dies (100) are stacked and packaged together to form a stacked package structure. The multiple dies (100) share a CS# pin, and the CS# pin is configured to turn on or turn off the stacked package structure. The multiple dies (100) also share an IO pin. The IO pin is configured to allow the stacked package structure to output a busy status signal or an idle status signal. Each die (100) is provided with a SYNC_PAD pin. The SYNC_PAD pins of the multiple dies (100) are electrically connected together, the SYNC_PAD pins are configured to judge whether the multiple dies (100) are all in an idle status or not, if yes, the stacked package structure is controlled to output the idle status signal through the IO pin, and if not, the stacked package structure is controlled to output the busy status signal through the IO pin. The multi-die stacked package memory and the output synchronization method thereof are simple in structure, easy to realize, stable and reliable.