Stacked Micro LED Structure for Accurate RGB Light Emission
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Solution Overview
Problem
Current light emitting diodes (LEDs) in display devices face challenges in achieving high color accuracy and reproducibility, particularly in micro LED displays, where the combination of blue, green, and red sub-pixels requires precise light emission and color filtering to produce accurate images.
Innovation Solution
A light emitting device with a stacked structure comprising multiple LED parts, each emitting different colors (blue, green, and red) and connected through contact structures, with color filters and adhesion layers to enhance electrical and physical bonding, ensuring uniform current distribution and improved light extraction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple LED parts are stacked to achieve high color accuracy and reproducibility, then light emission quality improves, but device complexity increases
Solution Approach 1:
The display device is divided into multiple LED parts, each emitting a specific color (blue, green, red), which are then stacked together. This segmentation allows each LED part to be optimized for its specific color emission, thereby achieving high color accuracy while managing complexity through modular design
Solution Approach 2:
The patent transitions from a planar arrangement of sub-pixels to a three-dimensional stacked structure of LED parts. By stacking LED parts vertically, the device achieves high color accuracy through multiple emission layers while reducing the horizontal footprint and improving light extraction efficiency
2Reliability
If contact structures extend into multiple LED parts for electrical coupling, then electrical connectivity improves, but manufacturing complexity increases
Solution Approach 1:
The contact structures serve multiple functions: they provide electrical coupling between stacked LED parts, act as bonding interfaces, and enable current distribution across multiple layers. This multi-functionality reduces the need for separate components, thereby improving electrical connectivity while managing manufacturing complexity
Solution Approach 2:
The contact structures act as intermediary elements between stacked LED parts, facilitating electrical coupling and mechanical bonding. These contact structures simplify the manufacturing process by providing standardized interfaces for assembling multiple LED parts while ensuring reliable electrical connectivity
3Illumination intensity
If color filters and adhesion layers are added to enhance light extraction and bonding, then light emission quality improves, but device complexity increases
Solution Approach 1:
The patent combines multiple functional layers (color filters, adhesion layers, contact structures) within the stacked LED part structure. By merging these functions into an integrated stacked architecture, the device achieves improved light extraction and bonding while managing overall complexity through consolidation rather than adding separate components
Solution Approach 2:
Color filters are selectively applied to specific LED parts based on their emission characteristics, and adhesion layers are placed at specific bonding interfaces. This localized application of functional layers optimizes light extraction for each color while maintaining structural integrity, thereby improving illumination quality without uniformly increasing complexity across the entire device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables excellent light reproducibility and color accuracy in micro LED displays by ensuring uniform light emission and improved electrical coupling between LED parts, enhancing the stability and efficiency of the light emitting device.
Implementation Method 1
a first contact structure contacting the first surface of the second n-type semiconductor layer, and a second contact structure contacting the second surface of the second n-type semiconductor layer. The first contact structure may extend into the first light emitting part to electrically contact the first n-type semiconductor layer, and the second contact structure may extend into the second light emitting part to electrically contact the third n-type semiconductor layer.
Implementation Method 2
a first light emitting part including a first n-type semiconductor layer, a first active layer, and a first p-type semiconductor layer, a second light emitting part disposed on a first surface of the first light emitting part, and including a second n-type semiconductor layer, a second active layer, and a second p-type semiconductor layer, a third light emitting part disposed on a first surface of the second light emitting part, and including a third n-type semiconductor layer, a third active layer, and a third p-type semiconductor layer
Data Source
AI summary
A light emitting device including a first light emitting part, a second light emitting part disposed on a first surface of the first light emitting part, and a third light emitting part disposed on a first surface of the second light emitting part, a first contact member contacting a surface of a second n-type semiconductor layer of the second light emitting part, an ohmic electrode electrically connected to a third p-type semiconductor layer of the third light emitting part, and an adhesive layer disposed between the second light emitting part and the third light emitting part, in which the first contact member extends toward the first light emitting part to be electrically connected to a first n-type semiconductor layer of the first light emitting part, and the adhesive layer extends toward the ohmic electrode.