Stacked Micro-LED Pixel Structure for Easier Full-Color Mounting
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Solution Overview
Problem
The challenge in micro-LED display technology is the difficulty in mounting a large number of small micro-LEDs on a display panel due to their tiny size, which affects the efficiency and reliability of the display.
Innovation Solution
The proposed solution involves constructing light emitting diode pixels with a stacked structure, where each pixel includes multiple LED sub-units with different semiconductor layers, allowing for simultaneous manufacturing and wafer-level bonding, thereby eliminating the need for individual mounting of each micro-LED.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If micro-LEDs are arranged on a two-dimensional plane with each subpixel requiring individual mounting, then color display capability is achieved, but mounting difficulty and time consumption increase significantly due to the small size and large quantity of micro-LEDs required
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of micro-LEDs to a three-dimensional stacked structure. Multiple LED stacks are vertically arranged within each pixel, with different stacks emitting different colors (red, green, blue). This vertical stacking enables color display while reducing the number of individual mounting operations required, as entire stacks can be mounted together rather than individual micro-LEDs.
Solution Approach 2:
The patent combines multiple LED stacks (first, second, and third LED stacks with different colors) into a single pixel structure. These stacks are electrically connected in parallel and mounted together on the display panel, merging what would otherwise be separate mounting operations into a single integrated mounting process.
2Adaptability or versatility
If micro-LEDs are arranged on a two-dimensional plane with each subpixel requiring individual mounting, then color display capability is achieved, but the number of mounting operations and time consumption increase significantly
Solution Approach 1:
By stacking LED stacks vertically in the third dimension, the patent reduces the lateral density of components that need to be individually mounted. Multiple color-emitting stacks share the same mounting footprint, thereby reducing the total number of mounting positions and operations required to achieve full-color display capability.
Solution Approach 2:
Multiple LED stacks are combined into integrated units that can be mounted simultaneously. The first, second, and third LED stacks are electrically connected in parallel and mounted together on the display panel, converting multiple sequential mounting operations into a single parallel mounting process, thereby significantly improving productivity.
3Productivity
If multiple LED stacks are stacked vertically within each pixel, then mounting complexity is reduced and manufacturing efficiency improves, but device structure becomes more complex
Solution Approach 1:
The pixel is segmented into multiple independent LED stacks (first, second, and third LED stacks), each responsible for emitting a specific color. These stacks are vertically arranged and electrically connected in parallel, allowing independent fabrication and testing of each stack before integration, which simplifies the overall manufacturing process despite the increased structural complexity.
Solution Approach 2:
The stacked LED structure serves multiple functions within a single pixel: it provides color emission through different stacks, maintains electrical connectivity through parallel connections, and enables simplified mounting by treating the stack as an integrated unit. This multi-functionality justifies the increased structural complexity by delivering multiple benefits simultaneously.
Data Source
AI summary
A light emitting diode pixel for a display includes a first subpixel including a first LED sub-unit, a second subpixel including a second LED sub-unit, a third subpixel including a third LED sub-unit, and a bonding layer overlapping the first, second, and third subpixels, in which each of the first, second, and third LED sub-units includes a first type of semiconductor layer and a second type of semiconductor layer, each of the first, second, and third LED sub-units is disposed on a different plane, and light generated from the second subpixel is configured to be emitted to an outside of the light emitting diode pixel by passing through a lesser number of LED sub-units than light generated from the first subpixel and emitted to the outside.