Stacked Optical Sensor Package for Compact Two-Way Light Detection
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Solution Overview
Problem
There is a need for more compact optical sensor packages to integrate multiple sensors within a single package, driven by the expansion of automotive and wearable device markets, where existing solutions lack efficiency in reducing package size while maintaining functionality.
Innovation Solution
A two-way optical sensor package design featuring a base substrate with a window, two optical sensors mounted on opposite sides, each encapsulated by light-pervious molds and encapsulant layers, and an interposer for electrical connectivity, allowing for compact two-way light detection without the need for additional components like caps or lids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple optical sensors are integrated within a single package, then the integration density is improved, but the package size reduction is limited due to component layout constraints
Solution Approach 1:
The patent transitions from a conventional single-sided sensor arrangement to a three-dimensional stacked configuration with sensors positioned on opposite sides of the package. The first optical sensor is mounted on the front surface with its light receiving surface facing the window, while the second optical sensor is mounted on the back surface with its light receiving surface facing away from the package, enabling vertical integration and reducing horizontal footprint.
Solution Approach 2:
The patent implements nested encapsulation structures where light-pervious encapsulant molds cover the light receiving surfaces of both sensors, and encapsulant layers are formed over the sensors and interconnection structures. The interposer is embedded within the encapsulant layers, creating a compact nested arrangement that maximizes space utilization.
2Length of stationary object
If a compact structure is achieved by overlapping components, then the package height is reduced, but the manufacturing complexity increases
Solution Approach 1:
The patent divides the optical sensor package into distinct functional modules: a base substrate with window, first optical sensor assembly with light-pervious encapsulant mold, second optical sensor assembly with light-pervious encapsulant mold, interposer for electrical interconnection, and encapsulant layers. This segmentation allows independent fabrication and testing of modules before final assembly, reducing overall manufacturing complexity despite the compact three-dimensional structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed design achieves a compact structure for optical sensor packages, enabling two-way light detection and reducing the overall height by overlapping components, thus addressing the need for increased integration density without sacrificing functionality.
Implementation Method 1
a first light-pervious encapsulant mold covering the light receiving surface of the first optical sensor, wherein the first light-pervious encapsulant mold is filled in the window of the base substrate
Data Source
AI summary
An optical sensor package comprises: a base substrate having a window; a first optical sensor mounted on a front surface of the base substrate, with its light receiving surface facing towards and aligned with the window; a first light-pervious encapsulant mold covering the light receiving surface of the first optical sensor; a first encapsulant layer formed on the front surface of the base substrate, wherein the first encapsulant layer comprises interlayer connects passing therethrough; an interposer mounted on the first encapsulant layer and electrically coupled to the base substrate through the interlayer connects of the first encapsulant layer; a second optical sensor mounted on a front surface of the interposer, with its light receiving surface facing away from the interposer; a second light-pervious encapsulant mold covering the light receiving surface of the second optical sensor; and a second encapsulant layer formed on the front surface of the interposer.