3D Stacked Optical Device Vertical Interconnect Architecture
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Solution Overview
Problem
Current optical packaging solutions face challenges in achieving high channel density and communication speeds due to operational surfaces and electrical contacts being on the same side, limiting the ability to meet increasing bandwidth requirements for future electronic devices.
Innovation Solution
A method of forming a three-dimensional stacked optical device by creating a communication path on a transparent substrate, mounting optical devices, embedding them in an insulating layer, and connecting an electronic chip to form a compact and high-density optical interconnect system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If optical devices are mounted with operational surfaces and electrical contacts on the same side, then assembly is simplified, but packaging density and communication speeds are limited
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement where operational surfaces and electrical contacts share the same side to a three-dimensional stacked architecture. Optical devices are vertically stacked with operational surfaces facing upward and electrical contacts on the opposite side, utilizing the vertical dimension to resolve the conflict between assembly simplicity and packaging density.
Solution Approach 2:
The patent segments the optical device into distinct functional regions: operational surfaces for light emission/detection and electrical contacts for signal input/output. By separating these functions spatially onto opposite sides of the device, the patent enables independent optimization of each function without interference, thereby improving both assembly ease and packaging density.
2Productivity
If more channels are added to meet increasing bandwidth requirements, then communication capacity increases, but packaging density decreases
Solution Approach 1:
The patent addresses the bandwidth-density conflict by stacking multiple optical device channels vertically in the third dimension rather than expanding horizontally. This allows hundreds or thousands of channels to be integrated within a compact footprint, simultaneously achieving high communication capacity and high packaging density.
Solution Approach 2:
The patent implements a nested structure where multiple optical devices and interconnect layers are stacked and integrated vertically, with each layer containing multiple channels. This nested arrangement enables high channel count within a minimal packaging area by efficiently utilizing vertical space.
3Ease of manufacture
If electrical communication busses are used, then current technology is sufficient, but bandwidth requirements cannot be met
Solution Approach 1:
The patent replaces electrical communication systems with optical communication systems. By substituting electrical signals with optical signals, the system achieves terabyte/second bandwidth rates that exceed the capabilities of electrical busses, while maintaining compatibility with existing manufacturing technologies through standardized optical component integration.
Data Source
AI summary
A method of forming a three-dimensional stacked optical device includes forming a communication path on a transparent substrate and mounting at least one optical device to the communication path. The optical device includes a first surface, coupled to the transparent substrate that extends to a second surface. The method further includes embedding the at least one optical device in an insulating layer including a first surface, abutting the transparent substrate, extending to a second surface, and forming a communication path between the first surface of the optical device and the second surface of the insulating layer. The method also includes mounting an electronic chip to the second surface of the insulating layer. The electronic chip is coupled to the communication path so as to form a three-dimensional stacked optical device.