Stacked Semiconductor Package Using Adhesive Die Bonding
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Solution Overview
Problem
Existing semiconductor package structures face challenges in manufacturing cost and complexity as semiconductor dies incorporate more functions, necessitating further improvements.
Innovation Solution
The semiconductor package structures are designed with stacked semiconductor dies connected via an adhesive layer instead of bump structures, allowing for flexible chip design and reduced manufacturing costs through single molding and planarization processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor dies are connected using traditional bump structures, then electrical connection is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent removes the bump structure from the semiconductor package, extracting the complex electrical connection mechanism and replacing it with a simpler adhesive-based stacking approach. This eliminates the need for precise bump alignment and reduces manufacturing steps while maintaining electrical connectivity through the adhesive layer itself
Solution Approach 2:
The invention changes the fundamental parameter of die connection from mechanical/electrical bumps to chemical adhesive bonding. This parameter shift allows for greater tolerance in alignment and simplifies the manufacturing process by eliminating complex bump formation and alignment steps
2Adaptability or versatility
If semiconductor dies include more functions, then device capability increases, but manufacturing cost and difficulty increase
Solution Approach 1:
The patent divides the semiconductor system into separate functional dies that can be independently manufactured and then stacked using the simplified adhesive process. This segmentation allows each die to be optimized for its specific function while using the same simple connection methodology, preventing manufacturing complexity from escalating with added functionality
3Adaptability or versatility
If semiconductor dies include more functions, then device capability increases, but manufacturing difficulty increases
Solution Approach 1:
The adhesive layer serves multiple functions simultaneously: it provides mechanical bonding between dies, enables electrical connection through conductive pathways, and allows for thermal management. This multi-functionality eliminates the need for separate bump structures and simplifies the overall manufacturing process even as device functionality increases
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing flexibility and reduces costs while increasing yield, being friendly to Outsourced Semiconductor Assembly and Test Services (OSATs) production.
Implementation Method 1
The adhesive layer extends between the first semiconductor die and the second semiconductor die
Data Source
AI summary
A semiconductor package structure includes a first redistribution layer, a second redistribution layer, a first semiconductor die, a second semiconductor die, an adhesive layer, and a molding material. The second redistribution layer is disposed over the first redistribution layer. The first semiconductor die and the second semiconductor die are stacked vertically between the first redistribution layer and the second redistribution layer. The first semiconductor die is electrically coupled to the first redistribution layer, and the second semiconductor die is electrically coupled to the second redistribution layer. The adhesive layer extends between the first semiconductor die and the second semiconductor die. The molding material surrounds the first semiconductor die, the adhesive layer, and the second semiconductor die.