Stacked Electronic Package Cooling Passage for Direct Coolant Contact
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Solution Overview
Problem
Existing heat dissipation methods in semiconductor devices, particularly those with high-performance chips and stacked structures, are inefficient, limiting the functionality and reliability of electronic modules.
Innovation Solution
An electronic package assembly with a cooling system that includes a base and upper electronic package separated by a support frame forming a cooling passage for coolant fluid contact with exposed electronic components, allowing direct heat exchange and efficient heat dissipation without additional space or processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader is attached on electronic modules to facilitate heat dissipation, then heat dissipation capability is improved, but device complexity and space requirements increase
Solution Approach 1:
The patent merges the cooling passage formation into the mold cap structure itself, combining the encapsulation function with the heat dissipation function. The cooling passage is integrated within the mold cap that already encapsulates the electronic components, eliminating the need for separate heat spreaders or additional cooling structures attached to the modules.
Solution Approach 2:
The mold cap serves multiple functions: it encapsulates the electronic components for protection and simultaneously houses the cooling passage for heat dissipation. This multi-functional design eliminates the need for separate dedicated cooling components, reducing overall device complexity while maintaining effective heat management.
2Temperature
If additional cooling structures are added to improve heat dissipation, then heat dissipation efficiency is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The cooling passage is formed as an integral part of the mold cap during the existing encapsulation molding process. This integration means that the cooling structure is created simultaneously with the protective encapsulation, eliminating the need for separate manufacturing steps and reducing overall manufacturing cost and process complexity.
3Adaptability or versatility
If electronic modules are stacked to increase functionality, then device functionality is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent addresses heat dissipation in stacked configurations by implementing cooling passages that extend through the vertical dimension of the mold cap. The cooling system is designed to accommodate multiple electronic components stacked vertically, with coolant flow paths that can effectively remove heat from each component in the stack, enabling high-density integration while maintaining thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides enhanced heat dissipation capacity through direct coolant contact with electronic components, maintaining electrical reliability and reducing production costs by eliminating the need for extra cooling structures.
Implementation Method 1
the cooling passage is configured for accommodating a coolant fluid and being in direct contact with the exposed ones of the at least one base electronic component and the at least one upper electronic component
Data Source
AI summary
An electronic package assembly and a method for forming the same are provided. The electronic package assembly comprises: a base package substrate, at least one base electronic component, and a base mold cap; a support frame attached on the base mold cap, wherein the support frame has a base opening exposing the base mold cap and the front surface of the base electronic component, and an upper opening in fluid communication with the base opening; an upper package substrate supported on the support frame, at least one upper electronic component facing towards the base electronic component, and an upper mold cap accommodated within the support frame, and the upper mold cap has a height smaller than that of the support frame to form a cooling passage between the upper mold cap and the base mold cap; and wherein the upper package substrate comprises an inlet and an outlet formed therethrough.