Stacked Semiconductor Package Heat Sink for Thermal and Signal Reliability
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Solution Overview
Problem
The increasing heat generation in highly integrated and functionalized semiconductor chips leads to performance degradation and potential damage if not effectively dissipated, and existing semiconductor packages struggle with heat dissipation and signal reliability.
Innovation Solution
A semiconductor package design featuring a lower and upper package substrate with integrated heat sinks and heat radiation patterns, including a heat radiator structure with alternating insulator and heat radiator layers, and a conductive structure to enhance heat dissipation and signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to semiconductor packages, then heat radiation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat sink and wiring structure into a single integrated component. The heat sink includes both heat radiation patterns and wiring lines formed on the same substrate, eliminating the need for separate heat dissipation and electrical connection structures. This integration reduces device complexity while maintaining effective heat radiation from semiconductor devices.
2Temperature
If multiple layers are stacked to improve heat dissipation, then heat radiation efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent forms the wiring lines and heat radiation patterns on the heat sink before stacking the semiconductor devices. By pre-forming the conductive structures and heat radiation patterns on the heat sink substrate, the manufacturing process ensures proper alignment and electrical connections are established prior to device mounting, reducing precision requirements during the stacking process.
3Device complexity
If heat sink structures are integrated with wiring structures, then device complexity is reduced, but signal transmission reliability may be affected
Solution Approach 1:
The patent applies different functional properties to different regions of the heat sink. The heat sink includes dedicated wiring lines for signal transmission and separate heat radiation patterns for thermal management. By providing localized electrical conduction paths distinct from the heat radiation structures, the integrated design maintains signal transmission reliability while achieving heat dissipation and structural simplification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat radiation efficiency, durability, and signal transmissibility while simplifying the manufacturing process of package-on-package-type semiconductor packages.
Implementation Method 1
a heat sink disposed so that at least a portion overlaps the wiring structure in at least one of the first direction and a second direction perpendicular to the first direction and including a heat radiation pattern, wherein the heat radiation pattern comprises an insulator and a heat radiator arranged in a repeated alternating pattern in the first and second directions, wherein the heat sink is exposed to an exterior of the semiconductor package
Data Source
AI summary
The semiconductor package includes a lower package including a lower package substrate and a lower semiconductor device disposed on the lower package substrate, and an upper package including an upper package substrate disposed on the lower package in a first direction and an upper semiconductor device disposed on the upper package substrate, and the upper package substrate includes a wiring structure on which the upper semiconductor device is mounted, and a heat sink disposed so that at least a portion overlaps the wiring structure in at least one of the first direction and a second direction perpendicular to the first direction and including a heat radiation pattern, wherein the heat radiation pattern comprises an insulator and a heat radiator in a repeated alternating pattern and wherein the lower semiconductor device overlaps at least a portion of the wiring structure and the portion of the heat sink in the first direction.