Stacked Package Electromagnetic Shielding Layer Design
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Solution Overview
Problem
Stacked semiconductor packages experience significant electromagnetic interference (EMI) due to the close proximity of multiple packages, leading to performance degradation and potential malfunctions in electronic devices.
Innovation Solution
A stacked package structure is designed with a lower and upper semiconductor package separated by a predetermined distance, featuring an inter-package connecting portion, an insulation layer, and an electromagnetic shielding layer to minimize EMI. The insulation layer prevents electrical shorts and surrounds the inter-package connecting portion, while the shielding layer is applied to the lateral and top surfaces to suppress electromagnetic waves.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If multiple semiconductor packages are vertically stacked to reduce device size, then compactness and integration density are improved, but electromagnetic interference between packages increases
Solution Approach 1:
An electromagnetic shielding layer is introduced as an intermediary component between stacked semiconductor packages. This shielding layer, positioned at the lateral and top surfaces of the lower package, acts as a mediator that blocks electromagnetic waves from transmitting between packages, thereby resolving the EMI issue while maintaining the compact stacked configuration
Solution Approach 2:
The electromagnetic shielding layer is nested within the overall package structure, conforming to the lateral and top surfaces of the lower semiconductor package. This nested arrangement allows the shielding function to be integrated into the compact stacked design without significantly increasing the overall device volume
2Productivity
If semiconductor packages are placed in close proximity to achieve high integration, then productivity and capacity are improved, but electromagnetic waves generated between packages cause performance degradation
Solution Approach 1:
The electromagnetic shielding layer serves as a protective intermediary that enables close package spacing for high integration while simultaneously protecting against electromagnetic interference, thus maintaining both productivity and reliability
3Object-affected harmful factors
If an electromagnetic shielding layer is added to suppress electromagnetic waves, then electromagnetic interference is reduced, but device complexity increases
Solution Approach 1:
The electromagnetic shielding layer is applied selectively only to the lateral and top surfaces of the lower semiconductor package, rather than enclosing the entire structure. This localized approach provides effective EMI shielding while minimizing the increase in device complexity and material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces EMI between stacked packages, enhancing the performance and reliability of electronic devices by physically and electrically connecting the packages while preventing electromagnetic interference.
Implementation Method 1
an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package
Data Source
AI summary
A stacked package structure is provided. The stacked package structure includes a stacked package including a lower semiconductor package, an upper semiconductor package disposed on the lower semiconductor package and spaced a predetermined distance apart from the lower semiconductor package, an inter-package connecting portion electrically connecting the lower semiconductor package and the upper semiconductor package while supporting a space therebetween, and an insulation layer disposed at least outside the inter-package connecting portion and filling the space between the lower semiconductor package and the upper semiconductor package, and an electromagnetic shielding layer surrounding lateral and top surfaces of the stacked package.