Stacked Electronic Package Layout Without Bond Wires
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Solution Overview
Problem
The use of bond wires to electrically connect GaN-based and/or GaAs-based amplifier circuits with Si-based control circuits increases the device area and package size, and traditional impedance matching circuits are inefficient, leading to performance issues.
Innovation Solution
An electronic package design with integrated circuit layers, conductive elements, and pre-formed connection components that eliminate the need for bond wires, allowing for reduced device area, improved impedance matching, and enhanced heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bond wires are used to electrically connect the control component and the amplifier component, then electrical connection is achieved, but the device area and package size increase
Solution Approach 1:
The patent merges the electrical connection function and heat dissipation function into a single integrated circuit layer structure. The circuit layer directly connects the control component and amplifier component without requiring separate bond wires, thereby reducing device area while maintaining electrical connectivity.
Solution Approach 2:
The patent extracts the bond wire connection method and replaces it with an integrated circuit layer approach. By removing the bond wires and using the circuit layer for both signal transmission and heat dissipation, the device footprint is reduced while achieving the same electrical connection function.
2Reliability
If traditional impedance matching circuits are used, then electrical connection is achieved, but impedance matching performance is insufficient
Solution Approach 1:
The circuit layer serves multiple functions simultaneously: it provides electrical connection between components, acts as an impedance matching structure, and functions as a heat dissipation path. This multi-functionality eliminates the need for separate impedance matching circuits, improving performance while reducing complexity.
Solution Approach 2:
The patent combines the impedance matching function with the circuit layer structure itself. By integrating impedance matching capabilities into the existing circuit layer rather than adding separate matching circuits, the design achieves better impedance matching performance with reduced overall circuit complexity.
3Area of stationary object
If components are stacked vertically to reduce package size, then package size decreases, but heat dissipation becomes more difficult
Solution Approach 1:
The circuit layer acts as an intermediary structure that simultaneously addresses electrical connection and heat dissipation needs. By using the circuit layer as both a signal transmission medium and a thermal conduction path, the design enables effective heat dissipation in the compact stacked configuration without requiring additional heat dissipation components.
4Stability of the object's composition
If uniform thickness and distance between components are ensured, then delamination is prevented, but manufacturing precision requirements increase
Solution Approach 1:
The patent combines multiple structural functions into the circuit layer, including mechanical support, electrical connection, and thermal management. This integration reduces the number of separate components and interfaces, thereby reducing the cumulative tolerance stack-up and lowering the overall manufacturing precision requirements while maintaining structural stability.
Data Source
AI summary
An electronic package is provided. The electronic package includes an amplifier component, a control component, and a first circuit layer. The control component is disposed above the amplifier component. The first circuit layer is disposed between the amplifier component and the control component. The control component is configured to transmit a first signal to the amplifier component and to output a second signal amplified by the amplifier component.