3D Stacked PCB With Component Recesses
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Solution Overview
Problem
The challenge in miniaturizing electronic devices lies in reducing the physical size of electrical components and their layout without complicating the manufacturing process, while maintaining cost-effectiveness.
Innovation Solution
The solution involves coupling rigid and flexible printed circuit boards to form a layered structure, with recesses and holes on one board receiving components from the other, and using anisotropic conductive adhesives for bonding, allowing for compact design without significant process modifications or additional costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If rigid and flexible printed circuit boards are coupled to form a layered structure, then the physical size of the electrical circuitry is reduced, but the device complexity increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from a two-dimensional planar layout to a three-dimensional layered structure. Multiple circuit boards are stacked vertically with components arranged on different layers, allowing compact integration while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
The patent implements nesting by placing components within recesses and holes of the circuit boards. Components are embedded into the layered structure rather than mounted on the surface, creating a compact nested arrangement that reduces overall volume while organizing components systematically across layers.
2Volume of moving object
If miniaturization is achieved through compact layout optimization, then the physical size is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent divides the electrical circuitry into separate modular circuit boards that can be manufactured independently using standard processes. Each board is segmented into functional layers with specific components, allowing parallel manufacturing and assembly without requiring complex monolithic fabrication.
Solution Approach 2:
By organizing components and circuits across multiple vertical layers rather than compressing everything into a single plane, the patent enables standard manufacturing techniques to be applied to each layer independently, avoiding the need for complex single-layer miniaturization processes.
3Volume of moving object
If aggressive miniaturization techniques are employed, then the physical size is reduced, but additional manufacturing costs are incurred
Solution Approach 1:
The patent employs universal adhesive bonding technology that serves multiple functions: mechanical attachment of layers, electrical insulation where needed, and structural support. This multi-functional approach eliminates the need for specialized expensive fastening mechanisms or additional structural components, keeping manufacturing costs low while achieving compact integration.
Solution Approach 2:
The layered vertical arrangement allows standard manufacturing and assembly techniques to be applied without modification, avoiding the need for expensive custom tooling or specialized processes that would be required for aggressive planar miniaturization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more compact portable devices with minimal manufacturing complexity and cost, achieving size reduction without complicating the manufacturing process.
Implementation Method 1
using anisotropic conductive adhesive for connection
Implementation Method 2
using anisotropic conductive adhesive for connection
Data Source
AI summary
An electric circuitry for a portable electronic device is presented. The electric circuitry includes a first printed circuit board comprising at least one electrical component attached to and extending from a surface of the first printed circuit board. The electric circuitry further comprises a second printed circuit board arranged to be coupled with the first printed circuit board and comprising at least one recess or hole arranged to receive the at least one electrical component extending from the surface of the first printed circuit board when the first circuit board and the second printed circuit board are coupled to each other.