Stacked PCB Power Supply Layout for Compact EV Heat Dissipation
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Solution Overview
Problem
The increasing size of vehicle-mounted power supply apparatuses in electric vehicles due to the growing demand for low-voltage power supply and heat dissipation requirements affects the layout and structural strength, necessitating a more compact and stable design.
Innovation Solution
A vehicle-mounted power supply apparatus with a stacked configuration of a lower-layer PCB board, upper-layer PCB board, and heat dissipator, supported by a bottom housing, which optimizes the layout and enhances structural strength while allowing flexible distribution of power conversion components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the power conversion circuit components are increased to meet growing low-voltage power supply requirements, then the power supply capability is improved, but the size of the vehicle-mounted power supply apparatus increases rapidly
Solution Approach 1:
The patent transitions from a planar arrangement of power conversion components to a three-dimensional stacked configuration. Multiple PCB boards are arranged in vertical layers with corresponding power switching transistors distributed across different levels, effectively utilizing the vertical dimension to accommodate increased component count without expanding the horizontal footprint of the apparatus.
Solution Approach 2:
The patent implements a nested structure where multiple PCB boards are stacked within a confined space, with each board containing power conversion components. The transformers are positioned to interact with components on adjacent PCB layers, creating a compact nested arrangement that maximizes power conversion capability within a reduced overall volume.
2Adaptability or versatility
If more components are added to the power conversion circuit, then the power conversion function is improved, but the structural strength of mounting is affected
Solution Approach 1:
The patent divides the power conversion circuit into multiple independent PCB boards, each carrying specific power switching transistors and circuit functions. This segmentation allows the mounting structure to be distributed across multiple attachment points on the bottom housing, preventing concentration of stress and maintaining structural strength while accommodating increased component count.
Solution Approach 2:
By distributing power switching transistors across multiple vertical layers on different PCB boards, the patent reduces the density of components on any single mounting plane. This three-dimensional distribution spreads the mechanical load across multiple attachment points, preserving the structural strength of the mounting while enabling enhanced power conversion functionality.
3Power
If the power conversion circuit size is increased, then the power supply capability is improved, but the layout of the entire vehicle is affected
Solution Approach 1:
The patent utilizes the vertical dimension by stacking multiple PCB boards and distributing power switching transistors across different levels. This three-dimensional configuration allows the power conversion circuit to achieve high power supply capability while maintaining a compact horizontal footprint, thus not affecting the overall vehicle layout.
Solution Approach 2:
The nested arrangement of multiple PCB boards within a compact enclosure, with transformers positioned to serve adjacent layers, creates a space-efficient power conversion system. This nested structure maximizes the power supply capability within a minimized volume, preserving valuable vehicle space for other components.
4Volume of moving object
If components are densely arranged to reduce size, then the space utilization is improved, but the heat dissipation becomes more challenging
Solution Approach 1:
By distributing power switching transistors across multiple vertical layers on different PCB boards, the patent increases the surface area available for heat dissipation without expanding the horizontal footprint. This three-dimensional arrangement allows heat to be dissipated from multiple levels, improving thermal management while maintaining a compact apparatus size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design reduces the size and improves space utilization, maintains stability under external forces, and ensures efficient heat dissipation, facilitating a miniaturized and robust power supply apparatus.
Implementation Method 1
the heat dissipator, the upper-layer PCB board, and the lower-layer PCB board are sequentially stacked
Implementation Method 2
the heat dissipator is configured to cool and dissipate heat for a heat generating component on the upper-layer PCB board
Data Source
AI summary
A vehicle-mounted power supply apparatus and a vehicle are disclosed. The vehicle-mounted power supply apparatus includes a power conversion circuit, and an upper-layer PCB board, a lower-layer PCB board, and a heat dissipator that are sequentially stacked and fastened to a bottom housing. The upper-layer PCB board and the lower-layer PCB board are configured to carry a plurality of power switching transistors of the power conversion circuit. The bottom housing is configured to support the upper-layer PCB board, the lower-layer PCB board, the heat dissipator, and a plurality of transformers.