Stacked PCB Vehicle Power Supply Layout for Compact High Power

The patent transitions from a planar arrangement of power conversion circuit components to a three-dimensional stacked configuration. Multiple PCB layers (first PCB, second PCB, third PCB) are vertically stacked with corresponding components arranged on different layers, allowing the system to utilize the vertical dimension for component placement. This dimensional transition enables higher component density without increasing the horizontal footprint, effectively resolving the contradiction between power supply capability and apparatus volume.

The patent implements a nested arrangement where power conversion circuit components are positioned within the vertical space occupied by multiple PCB layers. Components such as transformers, inductors, and capacitors are strategically placed between and around the stacked PCBs, utilizing the inter-layer spaces. This nesting approach maximizes space utilization, allowing more components to be accommodated within the same external volume, thereby improving power capability without proportionally increasing volume.

The patent divides the power conversion circuit into multiple functional modules distributed across separate PCB layers. Each PCB layer carries specific components and circuits, with clear functional segmentation. This modular segmentation allows the structure to be reinforced at critical mounting points for each module independently, maintaining structural strength while accommodating more components through distributed arrangement rather than concentrated addition.

By moving from a two-dimensional component layout to a three-dimensional stacked PCB configuration, the patent distributes component weight and mounting stresses across multiple vertical layers. The stacking architecture provides additional structural support surfaces and attachment points, enhancing overall mounting structural strength while enabling increased component count for improved power conversion capability.

The patent achieves volume reduction by stacking PCBs and components vertically, converting horizontal space requirements into vertical arrangement. This compact three-dimensional configuration reduces the overall footprint while maintaining structural integrity through the inherent rigidity of the stacked PCB architecture and strategic placement of support structures at key locations.

The patent employs composite construction combining multiple PCB materials, mounting structures, and support elements with different mechanical properties. The stacked PCB assembly integrates rigid substrates with reinforced mounting regions, creating a composite structure that provides high structural strength relative to its reduced volume, enabling compact design without sacrificing mounting strength.

The stacked PCB architecture creates vertical channels and inter-layer spaces that facilitate heat dissipation pathways. Hot components are positioned on specific layers with thermal vias and heat sinks extending through multiple layers, utilizing the vertical dimension for thermal management. This three-dimensional thermal design maintains effective heat dissipation while achieving compact volume through dense component arrangement.

The patent introduces thermal management intermediaries such as heat sinks, thermal vias, and cooling channels positioned between and around densely arranged components. These intermediary thermal conduction paths efficiently transfer heat from compactly positioned components to external cooling surfaces, maintaining heat dissipation effectiveness despite the reduced volume and increased component density.