Stacked Pin Fin Heat Radiator for High Power Semiconductor Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing heat output from semiconductor elements requires enhanced cooling performance beyond existing cooling apparatus designs, particularly for power devices in electric vehicles, hybrid vehicles, and trains.
Innovation Solution
A cooling apparatus with a heat radiator composed of stacked heat radiation units and intermediate plates, where pin-like fins on the substrate are oriented vertically and in thermal contact with both the casing walls and intermediate plates, enhancing heat transfer to the cooling fluid.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single heat radiation unit is used, then the device complexity is low, but the cooling performance is insufficient for high heat output semiconductor elements
Solution Approach 1:
The heat radiator is divided into multiple heat radiation units (first, second, and third units) arranged in series within the cooling fluid passage. Each unit contains pin-like fins that extend into the passage, creating multiple independent heat transfer zones. This segmentation allows the system to handle higher heat loads by distributing thermal dissipation across multiple units rather than relying on a single unit.
2Area of stationary object
If multiple heat radiation units are stacked, then the heat transfer area increases, but the device complexity increases
Solution Approach 1:
The multiple heat radiation units are arranged in the vertical direction (length dimension) within the cooling fluid passage rather than expanding horizontally. This vertical stacking approach increases the total heat transfer area by utilizing the passage length, allowing multiple units to coexist within the same lateral footprint and maintain compact overall dimensions.
Solution Approach 2:
The pin-like fins of adjacent heat radiation units are positioned to overlap in the vertical direction, with fins from upper units extending below the substrate of lower units and vice versa. This nested arrangement maximizes the use of the available vertical space within the cooling passage, allowing multiple heat radiation units to occupy overlapping spatial zones without interfering with each other's heat transfer functionality.
3Reliability
If pin-like fins are extended vertically, then heat transfer efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The vertical extension of pin-like fins is divided into multiple segments corresponding to different heat radiation units. Each unit's fins extend a controlled distance, and the overall vertical coverage is achieved through the combination of multiple units rather than requiring a single excessively long fin structure. This segmentation makes the manufacturing of individual fin segments more feasible while achieving the desired total heat transfer area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration increases the heat transfer area to the cooling fluid, improving cooling performance while maintaining low fluid passage resistance and allowing for adjustable heat radiation unit numbers, thus effectively managing the increased heat from semiconductor elements.
Implementation Method 1
The pin-like fin of the uppermost heat radiation unit is in thermal contact with the top wall of the casing, wherein the pin-like fin of the lowermost heat radiation unit is in thermal contact with the bottom wall of the casing, and wherein the pin-like fins of the heat radiation units located on the upper and lower sides of the intermediate plate are in thermal contact with the intermediate plate
Implementation Method 2
a cooling apparatus comprising: a casing provided with a top wall, a bottom wall, and a cooling fluid passage therein; and a heat radiator arranged in the cooling fluid passage in the casing
Data Source
AI summary
A cooling apparatus includes a casing including a top wall, a bottom wall, and a cooling fluid passage. A heat radiator arranged in the cooling fluid passage includes heat radiation units arranged in a vertical direction and at least one intermediate plate each of which is arranged between adjacent heat radiation units of the heat radiation units in the vertical direction. Each of the heat radiation units includes a substrate and pin fins provided on the substrate. The substrate of each of the heat radiation units and the at least one intermediate plate are spaced apart in the vertical direction. The pin fins of the adjacent heat radiation units are in thermal contact with the at least one intermediate plate. The pin fins of the uppermost and lowermost heat radiation units of the heat radiation units are in thermal contact with the top and bottom walls of the casing, respectively.