Stacked Infrared and Color Pixel Layout for TOF Image Sensing
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Solution Overview
Problem
Current image sensing devices face challenges in efficiently arranging heterogeneous pixels to optimize performance and area efficiency for capturing both color and depth images, particularly in applications requiring high-quality and high-performance imaging, such as smartphones and medical devices.
Innovation Solution
The proposed image sensing device incorporates a pixel array with stacked substrates, featuring infrared and color photoelectric conversion elements, allowing for optimal positioning of pixels to enhance performance and maximize area efficiency, enabling simultaneous capture of color and depth images using a Time of Flight (TOF) principle.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If heterogeneous pixels (infrared and color) are arranged in a single substrate, then device complexity is reduced, but pixel performance and area efficiency deteriorate due to interference and limited space
Solution Approach 1:
The pixel array is segmented into multiple substrates: a first substrate containing color pixels and a second substrate containing infrared pixels. This segmentation separates heterogeneous pixel types that would otherwise interfere with each other, allowing each pixel type to be optimized independently while maintaining overall system performance.
Solution Approach 2:
The patent transitions from a two-dimensional single-substrate arrangement to a three-dimensional stacked substrate configuration. By arranging color and infrared pixels on different substrates stacked in the vertical dimension, the patent eliminates spatial interference while maximizing area efficiency through vertical integration.
2Ease of manufacture
If infrared and color pixels are integrated in a single substrate, then manufacturing process is simplified, but area efficiency deteriorates due to pixel interference and limited optimization space
Solution Approach 1:
The pixel array is divided into separate substrates for color and infrared pixels, allowing each substrate to be optimized for its specific pixel type without compromising the other. This segmentation enables independent optimization of pixel size, arrangement, and optical characteristics, thereby improving area efficiency.
Solution Approach 2:
Multiple substrates are stacked in a nested configuration where the second substrate (infrared pixels) is positioned above the first substrate (color pixels). This nested arrangement allows both pixel types to coexist in a compact structure, maximizing area efficiency while maintaining manufacturing feasibility through standardized stacking processes.
3Reliability
If multiple substrates are stacked for heterogeneous pixels, then pixel performance and area efficiency are improved, but device complexity increases
Solution Approach 1:
The stacked substrate structure serves multiple functions simultaneously: it separates color and infrared pixels to eliminate interference, optimizes area efficiency through vertical arrangement, and maintains manufacturability through standardized stacking processes. This multi-functional design justifies the increased structural complexity by delivering superior pixel performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves pixel performance and area efficiency, enabling the device to effectively capture both color and depth images, enhancing imaging quality and processing speed in various applications.
Implementation Method 1
a first infrared photoelectric conversion element structured to respond to infrared light to generate photocharges corresponding to an intensity of infrared light received by the first infrared photoelectric conversion element
Implementation Method 2
a color photoelectric conversion element structured to respond to visible light to generate photocharges corresponding to an intensity of visible light received by the color photoelectric conversion element
Implementation Method 3
a second infrared photoelectric conversion element structured to respond to infrared light to generate photocharges corresponding to an intensity of infrared light that passes through the first infrared photoelectric conversion element and is received by the second infrared photoelectric conversion element
Data Source
AI summary
An image sensing device includes a first substrate and a second substrate. The first substrate includes a first infrared photoelectric conversion element structured to respond to infrared light to generate photocharges corresponding to an intensity of infrared light received by the first infrared photoelectric conversion element, and a color photoelectric conversion element structured to respond to visible light to generate photocharges corresponding to an intensity of visible light received by the color photoelectric conversion element. The second substrate stacked on the first substrate and configured to include a second infrared photoelectric conversion element structured to respond to infrared light to generate photocharges corresponding to an intensity of infrared light that passes through the first infrared photoelectric conversion element and is received by the second infrared photoelectric conversion element.