Stacked Photoelectric Conversion Pixels With Split Gate Dielectrics

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Solution Overview

Problem

Current photoelectric conversion apparatuses face challenges in achieving high pixel density while optimizing the relative permittivity of gate insulator films and reducing power consumption, particularly in the saturation charge of photoelectric conversion units.

Innovation Solution

The apparatus employs a stacked structure with different relative permittivity gate insulator films between transfer and amplifier transistors, where the gate insulator films are differentiated in nitrogen concentration or density to enhance drive force and reduce noise, and the transfer gates are designed to maintain a strong electric field while preventing leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the gate insulator film thickness is reduced to increase pixel density, then the drive force of transistors is improved, but leakage current increases and noise is generated

Engineering Contradiction:
Improvepixel densityVSAvoidleakage current and noise
Core Design Contradiction:
ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent applies different gate insulator film configurations to different transistor types: the transfer transistor uses a thicker gate insulator film (first thickness) to prevent leakage current, while the amplifier transistor uses a thinner gate insulator film (second thickness) to enhance drive force. This local differentiation resolves the contradiction by optimizing each transistor's gate insulator thickness according to its specific functional requirements rather than using a uniform thickness across all transistors.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the gate insulator film thickness parameter between different transistor types. By setting the gate insulator film thickness of the transfer transistor to be greater than that of the amplifier transistor, the patent achieves both high drive force (through the thinner film in amplifier) and low leakage current (through the thicker film in transfer transistor), thereby resolving the technical contradiction.

Inventive Principle:
Principle #35Parameter changes

2Power

If the relative permittivity of the gate insulator film is increased to enhance transistor drive force, then the transistor performance is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvetransistor drive forceVSAvoidmanufacturing complexity
Core Design Contradiction:
PowerVSDevice complexity

Solution Approach 1:

The patent applies high relative permittivity gate insulator films selectively to specific transistor regions where enhanced drive force is needed (amplifier transistor), while using standard gate insulator films in other regions (transfer transistor). This localized application of high-k materials achieves the desired performance improvement without requiring the entire device to be manufactured with complex high-k material processes.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs composite gate insulator structures combining different materials with different relative permittivities. By using a combination of high-k and standard-k gate insulator films in different locations, the patent achieves enhanced transistor drive force where needed while maintaining manufacturing feasibility through the use of conventional materials in other regions.

Inventive Principle:
Principle #40Composite materials

3Use of energy by stationary object

If the gate insulator film is made thinner to reduce power consumption, then power efficiency is improved, but saturation charge of photoelectric conversion units decreases

Engineering Contradiction:
Improvepower consumptionVSAvoidsaturation charge
Core Design Contradiction:
Use of energy by stationary objectVSQuantity of substance

Solution Approach 1:

The patent differentiates gate insulator film thickness between transfer and amplifier transistors: the amplifier transistor uses a thinner gate insulator film to reduce power consumption during signal amplification, while the transfer transistor uses a thicker gate insulator film to maintain proper charge transfer capability and preserve saturation charge levels in photoelectric conversion units. This local differentiation resolves the contradiction by applying thin films only where power reduction is beneficial.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach improves the drive force of amplifier transistors, reduces noise, and maintains high saturation charge levels, thereby enhancing the overall performance and efficiency of the photoelectric conversion apparatus.

Implementation Method 1

a photoelectric conversion element configured to receive light from the first surface

Methodology Applied
Scientific EffectPhotoelectric conversion: Photoelectric Effect

Implementation Method 2

The first gate insulator film and the second gate insulator film are different in relative permittivity

Methodology Applied
Scientific EffectDielectric permittivity: Dielectric Permittivity

Data Source

PatentUS20230395622A1Photoelectric conversion apparatus and equipment
Publication Date: 2023.12.07 CANON KK
  • US20230395622A1 patent drawing
  • US20230395622A1 patent drawing
  • US20230395622A1 patent drawing

AI summary

A photoelectric conversion apparatus includes a first component including a first semiconductor substrate having a first surface and a second surface opposite the first surface, a photoelectric conversion element configured to receive light from the first surface, a first semiconductor region, a transfer gate disposed on the second surface and configured to transfer a charge from the photoelectric conversion element to the first semiconductor region, and a first gate insulator film disposed between the second surface and the transfer gate, and a second component stacked on the first component and including a second semiconductor substrate having a third surface and a fourth surface opposite the third surface, an amplifier transistor including a gate connected to the first semiconductor region, and a second gate insulator film between the gate and the third surface. The first gate insulator film and the second gate insulator film are different in relative permittivity.