Vertically Stacked Power and Control Packages for Compact Integration

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Solution Overview

Problem

Conventional power modules face challenges in providing customized solutions due to varying control circuits, high fabrication costs, and limited integration capabilities, making them uneconomic and difficult to miniaturize.

Innovation Solution

A power module design where a power package and a control package are fabricated separately and vertically stacked, allowing for electrical coupling and independent optimization, reducing costs and enabling high integration and customization.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the power device and control device are disposed on the same horizontal plane in one package, then the package can be formed as a single unit, but it is difficult to reduce the size of the package and achieve high integration

Engineering Contradiction:
Improvepackage sizeVSAvoidintegration structure
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent transitions from a two-dimensional horizontal arrangement to a three-dimensional vertical stacking configuration. The power device and control device are disposed on different horizontal planes and stacked vertically, utilizing the vertical dimension to reduce the overall package footprint while maintaining all necessary functional components within a compact volume.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If various control circuits are customized according to different product types, then customer demands can be met, but it is difficult to provide different power modules due to productivity constraints

Engineering Contradiction:
Improvecustomization capabilityVSAvoidproduction efficiency
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The power module is divided into independent functional segments: a power device portion and a control device portion. Each segment can be designed, manufactured, and tested separately, then assembled into different module configurations to meet diverse customer requirements. This modular segmentation enables customization without compromising production efficiency.

Inventive Principle:
Principle #1Segmentation

3Reliability

If the control device is added to the power device to form a package, then the power module can be enhanced with control functionality, but the fabrication costs increase significantly

Engineering Contradiction:
Improvecontrol functionalityVSAvoidfabrication cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the power device and control device into a single integrated power module package. By combining these previously separate components into one unified module with shared packaging and interconnection structures, the design achieves cost-effective integration while maintaining reliable control functionality alongside power processing capabilities.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS7687903B2Power module and method of fabricating the same
Publication Date: 2010.03.30 SEMICON COMPONENTS IND LLC
  • US7687903B2 patent drawing
  • US7687903B2 patent drawing
  • US7687903B2 patent drawing

AI summary

Provided are a power module including a power package and a control package that are provided separately and can be highly integrated, and method of fabricating the power module. The power module includes: a molded power package including at least one power device on a first lead frame; and a molded control package vertically stacked on the power package, and including at least one control device on a second lead frame. A first part of the first lead frame and a first part of the second lead frame are coupled to each other so that the power package and the control package can be electrically coupled to each other.