Stacked Power Electronics with Thermal Resin Insulation
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Solution Overview
Problem
The existing electronic devices, such as inverter devices in vehicles, face challenges in efficiently cooling the power element and reducing the planar size due to heat generation and spatial constraints.
Innovation Solution
The electronic device incorporates a heat dissipation member with a high thermal conductivity housing, a resin layer with thermal fillers, and a stacked configuration of metal plates to prioritize heat dissipation from the power element, along with plate-shaped conductive members for efficient electrical connection, reducing the device's size and enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the first metal plate and the second metal plate are arranged next to each other on the same plane, then the electrical connection between power element and control element is simplified, but the planar size of the electronic device increases
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration. The first metal plate (power element mounting) and second metal plate (control element mounting) are arranged in different layers vertically, connected by conductive members. This dimensional change reduces planar footprint while maintaining electrical connectivity.
Solution Approach 2:
The conductive members extend through the insulation layer to connect the first and second metal plates, creating a nested structure where electrical connections are embedded within the layered construction. This nesting allows compact integration of multiple functional layers.
2Reliability
If the power element is efficiently cooled, then the reliability of the electronic device is improved, but the device structure becomes more complex
Solution Approach 1:
The insulation layer with high thermal conductivity acts as an intermediary between the first metal plate (power element) and the heat dissipation member. It provides both electrical insulation and thermal conduction, mediating between the conflicting requirements of electrical isolation and heat dissipation.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the insulation layer by incorporating heat dissipation fillers, transforming it from a simple insulator to a thermally conductive insulator. This parameter change enables simultaneous electrical insulation and efficient heat transfer.
3Temperature
If the first metal plate has greater thickness for better heat dissipation, then the cooling efficiency of the power element is improved, but the device volume increases
Solution Approach 1:
The first metal plate has locally increased thickness at the position of the power element to enhance heat dissipation where needed, while other areas maintain minimal thickness. This localized quality enhancement improves cooling efficiency without proportionally increasing overall device volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively cools the power element, reduces the device's planar size, and improves heat dissipation, addressing the inefficiencies and spatial limitations of previous designs.
Implementation Method 1
a heat dissipation member 20... The first metal plate 11, the resin layer 13, and the second metal plate 12 are stacked on the heat dissipation member 20
Implementation Method 2
The resin layer 13 is formed from an epoxy resin including fillers that have a good thermal conductivity such as glass fiber
Data Source
Figure 1
AI summary
An electronic device includes a heat dissipation member, a power element that is thermally coupled to the heat dissipation member, and a first conductive layer to which the power element is electrically coupled. The electronic device further includes a control element that controls a switching operation of the power element, a second conductive layer to which the control element is electrically coupled, and a resin layer arranged between the first conductive layer and the second conductive layer. The power element is embedded in the resin layer. The first conductive layer, the resin layer, and the second conductive layer are stacked on the heat dissipation member in this order from the ones closer to the heat dissipation member.