Vertically Stacked Power Module Pin Design for Area Reduction
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Solution Overview
Problem
Vertically stacked power modules face inefficiencies in pin production and insertion, occupy additional area on substrates, and have poor heat dissipation and structural reliability due to complex plastic packaging.
Innovation Solution
A pin design with a main body that includes an upper part connected to a first circuit module, a first connection surface at a middle part forming an angle for connection with a second circuit module, and a second connection surface at the terminal for connection with a third circuit module, allowing for efficient vertical stacking and reduced substrate area occupation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pins are inserted into substrates to connect vertically stacked modules, then electrical connections between modules are achieved, but the production process becomes complex and costly with low efficiency
Solution Approach 1:
The patent combines multiple pin functions into a single integrated pin structure that simultaneously provides electrical connection, mechanical support, and positioning functions. The pin integrates the anode connection, cathode connection, and module positioning capabilities into one component, eliminating the need for separate insertion processes for multiple components, thereby improving production efficiency while maintaining connection reliability
Solution Approach 2:
The pin is designed as a multi-functional component that serves multiple purposes: electrical connection between modules, mechanical support for vertical stacking, and positioning alignment. This universal design reduces the number of separate components and assembly steps required, directly addressing the productivity issue while ensuring reliable connections
2Reliability
If pins are used to connect vertically stacked modules, then electrical connections are established, but additional area is occupied on the substrates
Solution Approach 1:
The patent transitions from a planar connection approach to a three-dimensional vertical stacking approach. By utilizing the vertical dimension for module placement and connection, the design minimizes the horizontal substrate area required, allowing higher density integration while maintaining reliable electrical connections through the vertically oriented pin structure
3Temperature
If complex plastic packaging is used to encapsulate components, then heat dissipation path is provided, but structural reliability deteriorates
Solution Approach 1:
The patent extracts the heat dissipation function from the structural support function. Instead of relying on complex plastic packaging to provide both structural integrity and heat dissipation, the design separates these functions by using a simplified packaging structure for protection and a dedicated heat dissipation pathway through the pin and substrate thermal vias, thereby improving structural reliability while maintaining effective heat management
4Power
If vertically stacked structure is implemented, then power density is improved, but heat dissipation and structural reliability become poor due to complex packaging
Solution Approach 1:
The patent segments the vertically stacked module into simpler, more manageable components with clear functional separation. Each module uses a standardized pin structure for connection, allowing independent optimization of each segment while maintaining overall system reliability. The segmentation eliminates the need for complex integrated packaging across the entire stacked structure, improving both manufacturability and structural reliability
Data Source
AI summary
A power module with vertically stacked structure and a pin thereof are disclosed. The power module comprises at least three circuit modules. The at least three circuit modules are a first circuit module, a second circuit module and a third circuit module. The pin is led from the first circuit module. The pin comprises: a main body, a first connection surface and a second connection surface. An upper part of the main body is electrically connected with the first circuit module. The first connection surface is provided at a middle part of the main body and electrically connected with the second circuit module. The second connection surface is provided at a terminal of the main body and electrically connected with the third circuit module.