Stacked RGB LED Structure for Larger Sub-Pixels and Easier Mounting
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Solution Overview
Problem
Existing light emitting diode (LED) displays face challenges in reducing the size of LED chips to fit more sub-pixels in a restricted area, leading to increased manufacturing time and potential luminous area reduction, which complicates the mounting process and affects production yield.
Innovation Solution
A light emitting device with a stack structure of LEDs, including a first, second, and third LED stack, where each stack emits red, blue, and green light, respectively, with buried vias and connectors to enhance electrical connections and reduce the pixel area, allowing for increased sub-pixel area and improved mounting efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If LED chips are reduced in size to fit more sub-pixels in a restricted area, then the number of sub-pixels per pixel increases, but the luminous area of each LED chip decreases and mounting difficulty increases
Solution Approach 1:
The patent transitions from a two-dimensional arrangement of LED chips to a three-dimensional stacked structure. Multiple LED stacks are arranged vertically, with each stack containing multiple LED chips at different heights. This vertical stacking enables sub-pixels to occupy greater effective area while maintaining compact pixel footprint, and the standardized stack structure simplifies mounting procedures compared to individual chip placement.
Solution Approach 2:
Multiple LED chips emitting different colors (red, green, blue) are combined into integrated LED stacks. Each stack functions as a unified module containing chips of various colors, which are then mounted as complete units. This merging approach increases sub-pixel area within restricted pixel space and reduces mounting complexity by treating stacks as single assembly units rather than individual chips.
2Adaptability or versatility
If individual LED chips are arranged in each sub-pixel on a two-dimensional plane, then color display capability is achieved, but the number of LED chips increases and mounting time increases
Solution Approach 1:
LED chips of different colors (red, green, blue) are merged into integrated stacks where multiple chips coexist in a unified structure. Each stack functions as a complete color display unit, eliminating the need to mount separate chips for each sub-pixel. This significantly reduces mounting time while preserving full color display capability through the coordinated emission of chips within each stack.
Solution Approach 2:
The patent moves from two-dimensional chip arrangement to three-dimensional stacked configuration. LED chips are organized vertically in multiple layers within each stack, enabling color display functionality to be achieved through spatial arrangement in three dimensions rather than requiring numerous chips spread across a two-dimensional plane, thereby reducing total chip count and mounting time.
3Quantity of substance
If LED chips are reduced in size to increase sub-pixel count, then pixel density increases, but production yield decreases due to mounting complications
Solution Approach 1:
The patent implements vertical stacking of LED chips in three dimensions, increasing the effective number of sub-pixels without requiring proportionally smaller individual chip sizes. This vertical arrangement maintains adequate chip dimensions for reliable mounting while achieving higher sub-pixel counts per pixel, thereby preserving production yield through standardized mounting procedures.
Solution Approach 2:
Multiple LED chips are merged into integrated stacks that function as unified modules. These stacks are mounted as complete units, simplifying the mounting process and reducing the number of separate mounting operations required. This approach increases the effective sub-pixel count while maintaining high production yield through reduced mounting complexity and improved manufacturing efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution increases the area of each sub-pixel, reduces manufacturing time, and enhances production yield by facilitating the mounting process while maintaining luminous intensity through optimized LED stack configuration and electrical connections.
Implementation Method 1
Light emitting diodes have been used in various fields including displays, vehicular lamps, general lighting, and the like
Data Source
AI summary
A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material, in which a width of an upper end of the upper conductive material is greater than a width of the corresponding upper conductive material.