Stacked Semiconductor Cooling Structure for Heat Dissipation
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Solution Overview
Problem
Stacked semiconductor devices experience performance degradation and potential failures due to heat accumulation during operation, which current cooling methods are inadequate in addressing.
Innovation Solution
Integration of a cooling structure within the stacked semiconductor device, comprising heat removal and dissipation structures made of thermally conductive materials, including heat spreaders, heat pipes, and heat dissipation fins, to efficiently remove and dissipate heat from the dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If stacked semiconductor devices are operated at higher voltages and speeds to increase performance, then productivity and power increase, but heat accumulation worsens leading to device failures
Solution Approach 1:
The patent converts the harmful heat accumulation into a manageable thermal distribution pattern by implementing heat removal structures that channel heat away from critical die regions. The heat dissipation structures transform concentrated thermal energy into distributed heat flow, preventing localized overheating while maintaining operational performance.
Solution Approach 2:
The patent introduces intermediate thermal management components including heat removal structures positioned between heat-generating dies and heat dissipation structures. These intermediary elements facilitate controlled heat transfer, acting as thermal mediators that prevent direct heat accumulation at sensitive interfaces while enabling continuous operation at high performance levels.
2Reliability
If cooling structures are integrated into stacked semiconductor devices to improve heat management, then reliability increases, but device complexity increases
Solution Approach 1:
The patent merges cooling functions directly into the semiconductor device structure by integrating heat removal structures with die bonding interfaces and combining heat dissipation structures with existing device packaging. This integration approach eliminates separate cooling subsystems, reducing overall complexity while maintaining effective thermal management.
Solution Approach 2:
The patent designs thermal management structures that serve multiple functions: heat removal structures simultaneously provide thermal conduction paths and mechanical bonding interfaces, while heat dissipation structures serve both thermal management and structural support roles. This multi-functionality reduces the number of separate components needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated cooling structure reduces operating temperatures, enhances device performance, and increases reliability by effectively managing heat, allowing for higher voltages and speeds.
Implementation Method 1
a cooling structure including a plurality of heat removal structures configured to remove heat from at least one of the first die or the second die
Implementation Method 2
a plurality of heat dissipation structures configured to dissipate the heat
Implementation Method 3
heat dissipation structures configured to dissipate the heat
Data Source
AI summary
A stacked semiconductor device includes a cooling structure to increase the cooling efficiency of the stacked semiconductor device. The cooling structure includes various types of cooling components integrated into the stacked semiconductor device that are configured to remove and/or dissipate heat from dies of the stacked semiconductor device. In this way, the cooling structure reduces device failures and permits the stacked semiconductor device to operate at greater voltages, greater speeds, and/or other increased performance parameters by removing and/or dissipating heat from the stacked semiconductor device.