Stacked Semiconductor Device With Inductive Signal Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing System-on-a-Chip (SoC) technology faces limitations in function flexibility, requiring re-design and re-fabrication for different uses, leading to increased design and manufacturing costs, and inefficient use of chip area and manufacturing processes due to the need for power supply isolation between functional blocks.
Innovation Solution
A semiconductor device comprising multiple chips, where a main chip with signal processing and control circuits is combined with functional chips, allowing for selective activation of signal transmitting circuits via a common signal line group, and utilizing non-contact signal transmission methods like inductive coupling, to minimize the number of functional blocks and reduce chip area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple functional blocks are mounted on the same chip in an SoC, then occupied area is reduced and system manufacture cost is lowered, but function flexibility deteriorates requiring re-design and re-fabrication for different uses
Solution Approach 1:
The invention divides the semiconductor device into a main chip and multiple functional chips, where the main chip contains the signal processing circuit and functional chips contain different functional blocks. This segmentation allows the main chip to remain unchanged while functional chips are swapped to achieve different functions, resolving the contradiction between reducing chip area and maintaining function flexibility.
Solution Approach 2:
The main chip is designed with universal signal processing capabilities that can work with different functional chips. The signal processing circuit on the main chip is configured to interface with various types of functional blocks through standardized connections, enabling the same main chip to serve multiple functions by simply changing the functional chip.
2Productivity
If multiple functional blocks are manufactured on the same chip, then manufacturing process efficiency is improved, but manufacturing precision deteriorates as ideal processes cannot be utilized for every chip
Solution Approach 1:
By separating the main chip from functional chips, each chip can be manufactured using its own optimal process. The main chip uses a standard semiconductor manufacturing process while functional chips can use specialized processes suited to their specific functions, thereby maintaining both manufacturing efficiency and precision.
Solution Approach 2:
Different manufacturing processes can be applied to different chips based on their specific requirements. The main chip and functional chips can each be manufactured with process parameters optimized for their particular circuit requirements, achieving local quality optimization without compromising overall manufacturing efficiency.
3Reliability
If power supplies between functional blocks are isolated, then reliability is improved, but chip area increases and manufacturing cost rises
Solution Approach 1:
The invention places the power supply isolation mechanism at the chip level rather than the functional block level. Each chip (main chip and functional chips) has its own isolated power supply, eliminating the need for isolation structures between functional blocks on the same chip. This approach maintains reliability while significantly reducing chip area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes the need for new chip design and manufacturing, reduces chip area and costs, and allows for flexible function changes by swapping or adding functional chips, while optimizing manufacturing processes for each chip type.
Implementation Method 1
the first signal transmitting circuits and the second signal transmitting circuits are non-contact-type signal transmitting circuits utilizing inductive coupling
Data Source
AI summary
A main chip has a signal processing circuit for executing signal processing; a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and a signal transmitting circuit; and a control circuit for controlling operation/non-operation of the signal transmitting circuits in accordance with signal processing content of the signal processing circuit. Functional chips each have a signal processing circuit for executing auxiliary signal processing different from that of the signal processing circuit; and one or a plurality of signal transmitting circuits for transmitting signals between the signal processing circuit and the signal transmitting circuits. The main chip and the functional chips are stacked. The signal transmitting circuits and the signal transmitting circuit are non-contact-type signal transmitting circuits utilizing inductive coupling and are arranged so as to overlap when viewed from the stacking direction.