Stacked Semiconductor Package With Transparent Substrate
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Solution Overview
Problem
Semiconductor device packages, particularly those including image sensors, face challenges in achieving a balance between small size, high-density, low-power consumption, multi-functionality, high-speed data processing, high-reliability, and low-cost production while maintaining clear image quality, especially in the context of increasing demand for small and multi-functional electronic products.
Innovation Solution
The semiconductor package design involves a stacked configuration with a first semiconductor package and a second semiconductor package, where the second package includes an image sensor chip, a transparent substrate, an adhesive pattern, and a resin layer. The adhesive pattern has a wider top surface than its bottom surface, and the resin layer covers the image sensor chip and the adhesive pattern, providing structural support and protection while allowing for efficient signal transfer and processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a stacked configuration with multiple semiconductor packages is used to achieve high integration and small footprint, then device density and integration level are improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The semiconductor package is divided into multiple functional stacks: a first stack with a semiconductor chip on a package substrate, and a second stack with an image sensor chip, transparent substrate, and adhesive pattern. This segmentation allows independent manufacturing and testing of each stack before final assembly, reducing overall manufacturing complexity while achieving high device density through vertical integration.
Solution Approach 2:
The patent implements a nested structure where the second semiconductor package (containing the image sensor chip and transparent substrate) is stacked on top of the first semiconductor package. The adhesive pattern is nested between these layers, and the resin layer is nested around the peripheral sides. This nested doll approach enables high integration density while maintaining modular assembly processes.
2Strength
If the transparent substrate width is greater than the image sensor chip width to provide structural support, then mechanical strength and protection are improved, but the package area and size increase
Solution Approach 1:
The transparent substrate is designed with a width greater than the image sensor chip only in the regions where structural support is needed (peripheral areas), while maintaining close alignment over the chip area. This local quality approach provides enhanced mechanical strength and protection at the edges without significantly increasing the overall package area, as the expansion is localized to where it is structurally necessary.
3Reliability
If the adhesive pattern has a wider top surface than bottom surface to enhance bonding strength, then bonding reliability is improved, but material consumption and manufacturing complexity increase
Solution Approach 1:
The adhesive pattern is designed with an asymmetric trapezoidal cross-section where the top surface width is greater than the bottom surface width. This asymmetric geometry enhances bonding reliability by providing a larger bonding area at the top interface while maintaining a smaller footprint at the bottom. The design optimizes material consumption by concentrating adhesive material where it provides maximum bonding benefit rather than using a uniform width throughout.
4Reliability
If multiple layers including resin layer, adhesive pattern, and transparent substrate are used to protect the image sensor chip, then reliability and protection are improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent combines multiple protective functions into an integrated multi-layer structure: the resin layer provides peripheral protection and stress relief, the adhesive pattern provides bonding and localized protection, and the transparent substrate provides comprehensive coverage and mechanical support. These layers are merged into a cohesive protective system that enhances reliability without requiring separate independent protection mechanisms, thereby managing structural complexity through functional integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a highly integrated image sensor with a small footprint, enhancing reliability and image quality while minimizing external stress and damage from environmental factors, thus addressing the need for compact, high-performance semiconductor packages.
Implementation Method 1
an adhesive pattern interposed between the image sensor chip and the transparent substrate
Implementation Method 2
a resin layer covering a side surface of the image sensor chip and an outer side surface of the adhesive pattern
Data Source
AI summary
A semiconductor package device includes a first semiconductor package including a first package substrate and a semiconductor chip stacked on the first package substrate, and a second semiconductor package stacked on the first semiconductor package. The second semiconductor package includes a second package substrate, an image sensor chip stacked on the second package substrate, and a transparent substrate disposed on the image sensor chip. The first semiconductor chip may include a semiconductor memory device, a digital signal processor (DSP), an application specific integrated circuit (ASIC), and/or an image sensor driver circuit and may transfer, process and/or store signals output from the image sensor chip.