Stacked Semiconductor Package Signal Path Length Equalization
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Solution Overview
Problem
Existing stacked-type semiconductor packages face challenges in achieving equal electric lengths for data paths across multiple chip stacks, leading to increased costs due to the use of more expensive substrates like four-layer tapes.
Innovation Solution
A stacked-type semiconductor package design that includes a common path portion shared by both signal transmission paths, allowing the adjustment of the electric length of one path independently of the other, using a first and second tape with interconnection members to equalize the signal transmission paths between semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a four-layer substrate or tape is used to equalize electric lengths of stacked packages, then the electric length equality is achieved, but the manufacturing cost increases
Solution Approach 1:
The signal transmission path is segmented into a common path portion (shared by both chips) and individual path portions (specific to each chip). This segmentation allows independent adjustment of the second path portion length without affecting the first path portion, enabling electric length equalization using a cost-effective two-layer tape instead of an expensive four-layer substrate.
2Quantity of substance
If multiple chip packages are stacked to increase memory capacity, then the memory capacity increases, but the electric lengths of data paths become different
Solution Approach 1:
The design provides dynamic adjustability of the second path portion length to compensate for the inherent electric length differences introduced by stacking multiple chip packages. This allows the system to maintain electric length equality while achieving increased memory capacity through stacking.
3Device complexity
If a common path portion is shared by both signal transmission paths, then the structure complexity is reduced and cost is decreased, but the adjustment of electric length becomes more difficult
Solution Approach 1:
By segmenting the transmission path into common and individual portions, the patent enables independent adjustment of the second path portion while maintaining the cost benefits of a shared common path portion. This segmentation resolves the contradiction by making adjustment easier without requiring a completely separate path structure.
Data Source
AI summary
Corresponding parts to a first path portion in a first signal transmission path to a first semiconductor chip are an interconnection member and a second path portion a second signal transmission path to a second semiconductor chip and are not formed on the first tape. An electric length of the second signal transmission path is allowed to be adjusted independently of the first tape, so that the electric length of the second signal transmission path can be easily made equal to or substantially equal to that of the first signal transmission path.