Stacked Semiconductor Package Through-Substrate Conductor Design
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Solution Overview
Problem
The yield rate of stacked semiconductor device modules is a significant issue due to short-circuiting during the heating process, which affects the electrical connection between modules.
Innovation Solution
A semiconductor device package is designed with a multilayer structure featuring double side modules electrically connected by conductors and connectors, preventing short-circuiting and improving electrical connections between modules. This is achieved by using substrates with electronic components mounted on both surfaces, encapsulants, and conductors that pass through the substrates to connect with connectors, ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If modules are stacked with each other to increase integration, then device functionality is improved, but short-circuiting during heating process occurs reducing yield rate
Solution Approach 1:
The patent divides the electrical connection path into multiple segments: connectors on substrate surfaces, conductors passing through substrates, and intermediate connection points. This segmentation isolates potential short-circuit points and allows individual optimization of each connection segment, preventing complete connection failure during heating processes.
Solution Approach 2:
The patent introduces intermediate connectors and conductors as mediators between stacked modules. These intermediaries provide controlled transition points for electrical signals, allowing proper isolation and protection during heating processes, thereby preventing direct short-circuits between adjacent modules.
2Reliability
If conductors pass through substrates to connect modules, then electrical connection is improved, but manufacturing complexity increases
Solution Approach 1:
The patent forms conductors within substrates before stacking modules together. This preliminary action allows conductor paths to be pre-established and tested individually, simplifying the overall assembly process and reducing manufacturing complexity while ensuring reliable electrical connections between stacked modules.
Solution Approach 2:
The patent combines multiple functions into integrated components: substrates serve as both mechanical support and conductor carriers, connectors provide both electrical connection and structural alignment. This merging reduces the total number of discrete components and simplifies the manufacturing process while maintaining reliable electrical connections.
Data Source
AI summary
A semiconductor device package includes a first substrate and a second substrate arranged above the first substrate. A first connector is disposed on the first substrate, and a first conductor passes through the second substrate and connects to the first connector.