Stacked Semiconductor Component with Transparent Layer
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Solution Overview
Problem
Current semiconductor components with optically active areas face challenges in achieving high optical output power and packing density, as they often require larger structures to accommodate multiple radiation sources effectively.
Innovation Solution
The semiconductor component design involves stacking a first layer with a first optically active region and a second layer with a second optically active region, separated by a metallic layer with a transmission region that allows electromagnetic radiation to pass through, enabling increased radiation emission without enlarging the active regions. This configuration includes a metallic material for heat dissipation and electrical contacting, and can be integrated with a housing body that serves as a heat sink or optical element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple semiconductor chips are arranged in a linear arrangement with distance between adjacent chips, then the component structure is simple to manufacture, but the packing density and optical output power are reduced
Solution Approach 1:
The patent transitions from a one-dimensional linear arrangement of semiconductor chips to a three-dimensional stacked configuration. Multiple optically active areas are arranged in different layers (first layer, second layer, third layer) vertically stacked above each other, enabling high-density integration without increasing the horizontal footprint. This dimensional transition allows adjacent optically active areas to be positioned closely in the vertical direction while maintaining manufacturing feasibility through standardized stacking processes.
2Strength
If the second layer is made completely opaque to block radiation, then structural support is improved, but radiation transmission from the first layer is blocked
Solution Approach 1:
The second layer is designed with spatially varying optical properties: it contains both opaque regions (for structural support and electrical isolation) and transparent regions (for radiation transmission). Specifically, the second layer has a first transparent region aligned with the first optically active area to allow its radiation to pass through, while containing opaque second and third optically active areas for structural functions. This local differentiation of material properties resolves the contradiction between structural integrity and radiation transmission.
Solution Approach 2:
A fourth layer made of transparent material is introduced as an intermediary between the first and second layers. This intermediate layer facilitates radiation transmission from the first optically active area through the second layer to the exterior, while the second layer maintains its structural support function. The transparent fourth layer acts as a mediator that enables optical coupling without compromising the structural role of the second layer.
3Power
If optically active areas are enlarged to increase radiation output, then optical power is improved, but the device footprint and complexity increase
Solution Approach 1:
The patent increases optical output power by stacking multiple optically active areas in the vertical dimension rather than enlarging individual areas in the horizontal plane. The configuration includes a first optically active area in a first layer, a second optically active area in a second layer, and a third optically active area in a third layer, all positioned above each other. This vertical stacking multiplies the total radiation output while maintaining a compact horizontal footprint, effectively resolving the contradiction between power output and device area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances optical output power and packing density by allowing electromagnetic radiation to be emitted unhindered through the second layer, while simplifying heat dissipation and electrical contacting, and can produce a planar radiation source with predetermined optical characteristics.
Implementation Method 1
the metallic material of the further layer arranged between the first and second layer is designed to dissipate heat from the first and/or second layer, in particular from the first and/or second region
Implementation Method 2
the second layer has at least one cutout for transmitting the electromagnetic radiation of the first layer
Implementation Method 3
a first optically active first area for emitting electromagnetic radiation and at least one optically active second area for emitting electromagnetic radiation
Data Source
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AI summary
The invention relates to a semiconductor component that comprises at least one optically active first area (112) for emitting electromagnetic radiation (130) in at least one direction of radiation and at least one optically active second area (122) for emitting electromagnetic radiation (130) in the at least one direction of radiation. The first area (112) is arranged in a first layer (110) and the second area (122) is arranged in a second layer (120). The second layer (120) is arranged in the direction of radiation above the first layer (110) and comprises a first passable area (124) that is associated with first area (112), said passable area being at least partially permeable to the electromagnetic radiation (130) of the first area (112).