Stacked Semiconductor Package With Variable Wire Diameters
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Solution Overview
Problem
Conventional stacked semiconductor packages waste material due to identical wire diameters, leading to increased manufacturing costs and structural issues such as wire neck tearing or contact with adjacent wires.
Innovation Solution
The use of first wires with smaller diameters and second wires with larger diameters, where the second wires connect semiconductor devices to a carrier, reducing material usage and manufacturing costs while minimizing the risk of wire neck tearing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wires with identical diameters are used for all semiconductor devices, then manufacturing simplicity is maintained, but material waste increases and manufacturing cost increases
Solution Approach 1:
The patent applies different wire diameters to different semiconductor devices based on their specific requirements. First wires with first diameters are used for first semiconductor devices, while second wires with second diameters are used for second semiconductor devices, allowing each wire to be optimally sized for its specific application rather than using a uniform diameter for all devices.
2Ease of manufacture
If wires with identical diameters are used for all semiconductor devices, then manufacturing simplicity is maintained, but manufacturing cost increases
Solution Approach 1:
The patent applies different wire diameters to different semiconductor devices based on their specific requirements. First wires with first diameters are used for first semiconductor devices, while second wires with second diameters are used for second semiconductor devices, allowing each wire to be optimally sized for its specific application rather than using a uniform diameter for all devices.
3Loss of substance
If small radius arc is used for first wires, then material usage is reduced, but wire neck is prone to tearing
Solution Approach 1:
The patent applies different wire diameters to different semiconductor devices based on their specific requirements. First wires with first diameters are used for first semiconductor devices, while second wires with second diameters are used for second semiconductor devices, allowing each wire to be optimally sized for its specific application rather than using a uniform diameter for all devices.
4Reliability
If large radius arc is used for first wires, then wire strength is improved, but risk of wire contact with second wires increases
Solution Approach 1:
The patent applies different wire diameters to different semiconductor devices based on their specific requirements. First wires with first diameters are used for first semiconductor devices, while second wires with second diameters are used for second semiconductor devices, allowing each wire to be optimally sized for its specific application rather than using a uniform diameter for all devices.
Data Source
AI summary
A stacked semiconductor package, includes a carrier, a first semiconductor device, a second semiconductor device, a plurality of first wires and a plurality of second wires. The carrier has a plurality of electrically connecting portions. The first semiconductor device has a plurality of first pads. The second semiconductor device has a plurality of second pads. The second semiconductor device is disposed on the first semiconductor device. The first wires electrically connect the first pads of the first semiconductor device and the electrically connecting portions of the carrier, and the second wires electrically connect the second pads of the second semiconductor device and the electrically connecting portions of the carrier. The diameters of the second wires are larger than those of the first wires. Thus, the material of the wires is reduced, and the manufacturing cost is reduced.