Stacked Sensor Package Structure With Exposed Optical Sensing Area
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Solution Overview
Problem
Current semiconductor packaging technologies face challenges in integrating multiple dies efficiently to achieve lightweight, miniature, and high-density electronic products that meet market requirements for small size and high performance.
Innovation Solution
A package structure and manufacturing method that integrate a first die for sensing and a second die for data processing, using a dam structure, light-transmitting sheet, conductive connector, and circuit layers to enhance electrical connectivity and performance, with a method involving wafer processing, through silicon via formation, and encapsulant application.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple dies are integrated into a single package structure, then sensing and processing performance is improved, but device complexity increases
Solution Approach 1:
The patent combines a first die (sensing element) and a second die (data processing element) into a single integrated package structure. The dies are mounted in close proximity with their back surfaces facing each other, enabling integrated sensing and processing functions within one package, thereby improving overall system performance and reliability.
Solution Approach 2:
The package structure is segmented into distinct functional components: a first die for sensing, a second die for data processing, an encapsulant for protection, a dam structure for isolation, and circuit layers for electrical connection. This segmentation allows each component to perform its specific function while maintaining overall system integration.
2Productivity
If multiple dies are integrated to achieve high density, then productivity and compactness are improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent arranges the first and second dies with their back surfaces facing each other in a vertical stacking configuration rather than placing them side-by-side in the same plane. This three-dimensional arrangement increases integration density while reducing the lateral footprint and simplifying alignment requirements compared to planar integration approaches.
Solution Approach 2:
The patent introduces an encapsulant that covers and bonds the back surfaces of both dies, serving as an intermediary bonding layer. This encapsulant facilitates precise alignment and secure bonding between the dies during the manufacturing process, reducing the difficulty of achieving high-precision alignment.
3Reliability
If a dam structure and light-transmitting sheet are added to expose the sensing area, then sensing capability is improved, but device complexity increases
Solution Approach 1:
The patent extracts the sensing area from beneath the encapsulant by forming a dam structure that exposes the active surface of the first die. This allows light to reach the sensing elements directly without passing through the encapsulant material, improving sensing capability while maintaining package integration.
Solution Approach 2:
The light-transmitting sheet serves as an intermediary component placed on the dam structure. It facilitates light transmission to the sensing area while providing structural support and defining the optical path, thereby enhancing sensing capability without requiring direct modification of the die structure.
Data Source
AI summary
A package structure including a first die, a second die, an encapsulant, a dam structure, a light-transmitting sheet, a conductive connector, a circuit layer, and a conductive terminal is provided. The first die includes a first active surface. The first active surface has a sensing area. The second die is arranged such that a second back surface thereof faces the first die. The encapsulant covers the second die. The encapsulant has a first encapsulating surface and a second encapsulating surface. The dam structure is located on the first encapsulating surface and exposes the sensing area. The light-transmitting sheet is located on the dam structure. The conductive connector penetrates the encapsulant. The circuit layer is located on the second encapsulating surface. The first die is electrically connected to the second die through the conductive connector and the circuit layer. The conductive terminal is disposed on the circuit layer.