Stacked Solid-State Image Sensor Layout for Smaller Terminal Area
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Solution Overview
Problem
As solid-state imaging apparatuses become smaller, the size of their terminal portions for signal extraction increases, making it difficult to further miniaturize the apparatus.
Innovation Solution
A laminate structure is employed, with a pixel array unit for photoelectric conversion above and an input/output circuit unit with through holes and external terminals below, allowing for efficient signal input/output while minimizing the apparatus size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a plurality of semiconductor substrates are laminated to reduce apparatus size, then the overall device volume decreases, but the terminal portion area increases relative to the horizontal size
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, placing the pixel array on one substrate and the input/output circuits on another substrate below it. This vertical stacking enables signal terminals to be positioned on the bottom surface of the lower substrate, effectively utilizing the third dimension to reduce both apparatus volume and terminal portion area ratio.
2Ease of operation
If terminal portions are enlarged to facilitate signal extraction, then signal connectivity is improved, but the apparatus cannot be made smaller
Solution Approach 1:
The patent extracts the input and output circuits from the pixel array substrate and places them on a separate lower substrate. This separation allows signal terminals to be positioned on the bottom surface of the lower substrate, removing them from the horizontal plane of the pixel array and enabling compact integration without compromising signal extraction capability.
3Quantity of substance
If a laminate structure is used to reduce size, then integration density increases, but manufacturing complexity increases
Solution Approach 1:
The patent divides the imaging device into functionally independent semiconductor substrates: one containing the pixel array and another containing the input/output circuits. This segmentation allows each substrate to be manufactured and tested independently before final assembly, reducing overall manufacturing complexity despite the increased integration density achieved through lamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a more compact design by optimizing the placement of signal processing and terminal components, allowing for further reduction in apparatus size without compromising functionality.
Implementation Method 1
a pixel array unit in which pixels that perform photoelectric conversion are two-dimensionally arranged
Data Source
AI summary
The present disclosure relates to a solid-state imaging apparatus, a manufacturing method of the same and an electronic device which can make an apparatus size further smaller. A solid-state imaging apparatus includes: a laminate of a first structure in which a pixel array unit in which pixels that perform photoelectric conversion are two-dimensionally arranged is formed and a second structure in which an output circuit unit configured to output pixel signals output from the pixels to an outside of an apparatus is formed. The output circuit unit, a first through hole via which penetrates through a semiconductor substrate constituting part of the second structure, and an external terminal for signal output connected to the outside of the apparatus are disposed below the pixel array unit of the first structure. The present disclosure can be applied, for example, to a solid-state imaging apparatus or the like.