Stacked Image Sensor Via Coupling for Stable Multi-Substrate Wiring
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Solution Overview
Problem
Existing solid-state imaging devices lack detailed examination of variations in electrical coupling methods for signal and power supply lines between stacked substrates, limiting performance improvements.
Innovation Solution
A solid-state imaging device with a novel coupling structure that includes a via with embedded electrically-conductive materials in through holes or films on the inner walls of the holes, allowing for improved electrical coupling between stacked substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional electrical coupling methods (pad coupling or TSV) are used between stacked substrates, then the device can be manufactured with existing processes, but the performance and stability of the electrical coupling are limited
Solution Approach 1:
The patent introduces a via structure as an intermediary element between the first and second substrates. The via includes a via hole formed through the first substrate, with an electrically conductive material embedded within it, creating a mediator that facilitates electrical coupling between the substrates. This intermediary structure provides more stable and reliable electrical connections compared to conventional pad or TSV methods.
Solution Approach 2:
The via structure employs a nested configuration where the electrically conductive material is embedded within the via hole, which itself is formed within the first substrate. The coupling structure further nests the second substrate onto the first substrate, with the via structure nested between them. This nested arrangement enhances coupling stability while managing structural complexity through hierarchical organization.
2Adaptability or versatility
If multiple through holes are formed to expose different wiring lines, then more signal and power supply lines can be coupled, but the manufacturing process becomes more complex
Solution Approach 1:
The patent divides the electrical coupling function into multiple segmented via structures. Each via structure includes a via hole exposing a specific wiring line, with electrically conductive material embedded in each. This segmentation allows different signal and power supply lines to be coupled independently through separate via holes, increasing adaptability while maintaining manageable manufacturing complexity through modular via formation.
Solution Approach 2:
The patent utilizes the vertical dimension by forming via holes that extend through the thickness of the first substrate. This vertical dimensionality allows multiple wiring lines at different horizontal positions to be accessed and coupled through separately formed via holes, enabling multiple signal and power supply lines to be coupled without increasing horizontal complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the performance of the solid-state imaging device by enabling more effective coupling of signal and power supply lines, leading to improved performance and stability.
Implementation Method 1
a via having a structure in which electrically-conductive materials are embedded in a first through hole that exposes a predetermined wiring line in the first multi-layered wiring layer and in a second through hole that exposes a predetermined wiring line in the second multi-layered wiring layer
Data Source
AI summary
A solid-state imaging device including: a first substrate having a pixel unit, and a first semiconductor substrate and a first wiring layer; a second substrate with a circuit, and a second semiconductor substrate and a second wiring layer; and a third substrate with a circuit, and a third semiconductor substrate and a third wiring layer. The first and second substrates are bonded together such that the first wiring layer and the second semiconductor substrate are opposed to each other. The device includes a first coupling structure for electrically coupling a circuit of the first substrate and the circuit of the second substrate. The first coupling structure includes a via in which electrically-conductive materials are embedded in a first through hole that exposes a wiring line in the first wiring layer and in a second through hole that exposes a wiring line in the second wiring layer or a film-formed structure.