Stacked Light-Receiving Substrate Layout for X-Ray Discharge Isolation
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Solution Overview
Problem
Semiconductor devices used in X-ray imaging and other applications face challenges in achieving improved discharge withstand voltage, particularly due to issues like creeping discharge and electron release, which can lead to reduced reliability and performance.
Innovation Solution
The design involves stacking semiconductor substrates with an interlayer insulating layer, where the side surface of the logic substrate is recessed more inward than the sensor substrate, and a protective film is applied to the side surface of the logic substrate, along with specific electrically-conductive regions and guard rings to manage potential differences and reduce discharge occurrences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the side surface of the logic substrate is recessed more inward than the sensor substrate and coated with a protective film, then discharge withstand voltage is improved, but device complexity increases
Solution Approach 1:
The logic substrate is recessed in the vertical dimension relative to the sensor substrate, creating a stepped configuration. This dimensional change increases the creepage distance along the surface without requiring additional lateral space, thereby improving discharge withstand voltage while managing the added structural complexity through vertical integration rather than horizontal expansion.
Solution Approach 2:
A protective film is introduced as an intermediary layer on the recessed side surface of the logic substrate. This film acts as a mediator that enhances the insulating properties and further increases discharge withstand voltage by providing an additional barrier against surface discharge, while the recessed structure itself serves as a geometric intermediary that extends the discharge path.
2Reliability
If electrically-conductive regions and guard rings are added to manage potential differences, then discharge prevention is improved, but manufacturing complexity increases
Solution Approach 1:
The peripheral region of the logic substrate is segmented into multiple functional zones: electrically-conductive regions are divided into first and second regions with different potentials, and guard rings are segmented into first and second guard rings. This segmentation allows for controlled potential distribution and discharge management, with each segment serving a specific function in preventing discharge while maintaining a systematic manufacturing approach.
Solution Approach 2:
Electrically-conductive regions are configured to maintain equipotential surfaces at different voltage levels. The first electrically-conductive region is held at a first potential while the second is held at a second potential, creating controlled equipotential zones that prevent uncontrolled discharge. This equipotential configuration manages potential differences systematically, reducing manufacturing complexity by providing clear voltage zone definitions.
Data Source
AI summary
A first light-receiving device of an embodiment of the disclosure includes: a first semiconductor substrate having first and second surfaces opposed to each other, receiving application of a first potential, and including light-receiving elements arranged two-dimensionally in matrix; a second semiconductor substrate having third and fourth surfaces opposed to each other, with the first surface and the third surface being disposed to be opposed to each other, receiving application of a second potential lower than the first potential, and including a logic circuit that processes a light-receiving signal based on electric charge outputted from the plurality of light-receiving elements; and an interlayer insulating layer provided between the first and second semiconductor substrates, in which the second semiconductor substrate has a side surface recessed more inward than a side surface of the first semiconductor substrate, and the side surface of the second semiconductor substrate is coated with a protective film.