Stacked Transformer Power Converter for Low-Inductance PCB Delivery
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Solution Overview
Problem
Conventional printed circuit boards (PCBs) are dimensionally limited and inefficient in power conversion, leading to high lateral losses and transient issues due to series resistance and inductance, which hinder high-density circuitry and efficiency in powering processors.
Innovation Solution
A power converter assembly with multiple transformer windings stacked orthogonally to a substrate, utilizing magnetically permeable structures and switch circuitry to convert DC input voltage efficiently, reducing series resistance and inductance, and enabling high-density circuitry.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional planar PCB circuitry is used, then manufacturing is simple, but power conversion efficiency is low due to high series resistance and inductance
Solution Approach 1:
The patent transitions from conventional planar (2D) PCB circuitry to a three-dimensional stacked circuit board architecture. Multiple circuit boards are stacked vertically with transformer windings embedded between layers, enabling power conversion circuits to be integrated in the vertical dimension rather than spreading out horizontally. This dimensional change reduces series resistance and inductance by shortening current paths while maintaining manufacturing simplicity through standardized stacking processes.
2Reliability
If lateral power connection is used, then device layout is simple, but transient response is poor due to high series inductance
Solution Approach 1:
The patent replaces lateral (horizontal) power connections with vertical connections through the stacked circuit board structure. Power and ground traces are routed vertically through via holes between stacked layers, dramatically reducing the loop area and series inductance. This vertical routing approach improves transient response by minimizing the L di/dt voltage drops while the modular stacked design keeps the connection structure manageable through standardized interlayer bonding.
3Quantity of substance
If conventional PCB layout is used, then manufacturing is easy, but circuit density is low
Solution Approach 1:
The patent achieves high circuit density by utilizing the vertical dimension through stacked circuit boards. Multiple functional layers including power conversion circuits, control logic, and I/O interfaces are distributed across several stacked boards with transformer windings embedded between them. This vertical stacking multiplies the effective circuit area without increasing the horizontal footprint, while manufacturing remains feasible through standardized PCB fabrication and bonding processes.
Solution Approach 2:
The patent embeds transformer windings within the stacked circuit board structure, nesting the magnetic components inside the vertical stack rather than mounting them externally. The transformer primary and secondary windings are integrated between circuit layers, with magnetic cores positioned within the stack. This nesting approach maximizes circuit density by utilizing the internal volume of the stacked structure while maintaining ease of manufacture through co-fabrication of the embedded components.
4Power
If 48V to 12V intermediate rail conversion is used, then power delivery is improved, but total loss increases due to cascaded conversion stages
Solution Approach 1:
The patent merges the 48V to 12V conversion and 12V to core voltage conversion into a single integrated power converter assembly. The stacked circuit board structure houses both conversion stages in close proximity with shared magnetic components and control logic, eliminating the need for separate intermediate rail distribution. This consolidation reduces total conversion loss by minimizing the number of active conversion stages and reducing parasitic losses in interconnects, while maintaining high power delivery capability through the integrated architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides efficient power conversion with reduced losses and higher density, addressing transient issues and enabling more effective use of raw energy, thus reducing environmental impact.
Implementation Method 1
multiple transformer windings disposed between the multiple circuit layers in the stack, the multiple transformer windings including one or more primary windings and one or more secondary windings
Implementation Method 2
utilizing magnetically permeable structures and switch circuitry to convert DC input voltage efficiently
Data Source
AI summary
This disclosure includes a power converter assembly comprising: a stack of multiple circuit layers; multiple transformer windings disposed in the stack of multiple circuit layers, the multiple transformer windings including one or more primary windings and one or more secondary windings; and a first connectivity interface operative to connect the stack of multiple circuit layers to a host substrate. The first connectivity interface may be disposed on a first surface of the stack of multiple circuit layers. The first surface such as edges of the multiple circuit layers may be disposed substantially orthogonal with respect to planar surfaces of each of the multiple circuit layers of the stack to provide advantageous output of an output voltage generated by the power converter assembly to a load such as through the host substrate.