Stacked Vertical Capacitor Structure for Low ESR and High Density

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Solution Overview

Problem

There is a need for vertical capacitor structures that are stackable, embeddable, and offer improved performance in terms of low equivalent series resistance, capacitance, and functional density, while maintaining modularity and customizability.

Innovation Solution

The development of stackable and embeddable vertical capacitors, where capacitor elements are stacked in parallel to achieve desired performance and dimensional parameters, and methods for fabricating these capacitors, including embedding them within substrates and using specific terminal configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If capacitor elements are stacked in parallel to achieve desired performance parameters, then capacitance increases and equivalent series resistance decreases, but device complexity increases

Engineering Contradiction:
Improvecapacitance performanceVSAvoidstacking structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The capacitor is divided into multiple discrete capacitor elements that can be independently fabricated and then stacked in parallel. Each element contains its own electrodes and dielectric layers, allowing the total capacitance to be the sum of individual capacitances while maintaining manageable complexity through modular construction

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Capacitor elements are stacked vertically one on top of another in a nested configuration, with lower elements serving as the foundation for upper elements. This nesting approach maximizes space utilization and achieves parallel connection without requiring complex lateral arrangements

Inventive Principle:
Principle #7Nested doll (Nesting)

2Productivity

If vertical capacitor structures are designed to be embeddable within substrates, then functional density increases, but manufacturing precision requirements increase

Engineering Contradiction:
Improvefunctional densityVSAvoidembedding alignment precision
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

Capacitor elements are partially formed and prepared in advance before final embedding into the substrate. Electrodes are pre-positioned and dielectric layers are pre-deposited, allowing for controlled insertion and alignment during the embedding process rather than requiring all operations to be performed simultaneously with high precision

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

An intermediary embedding process is introduced that facilitates the integration of vertical capacitor structures into substrates. This intermediary step provides alignment features and positioning mechanisms that reduce the direct precision requirements between capacitor elements and substrate features

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution enables the creation of stacked vertical capacitor devices with lower equivalent series resistance and higher capacitance, while allowing for modular and customizable designs that can be embedded within various substrates.

Implementation Method 1

an oxide layer may be formed between the first and second electrodes to serve as the dielectric

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

the metal foil may be selectively etched and anodized on one side to define the porous, high surface area

Methodology Applied
Scientific EffectEtching:

Implementation Method 3

the metal foil may be selectively etched and anodized on one side to define the porous, high surface area

Methodology Applied
Scientific EffectAnodization: Anodising

Implementation Method 4

electroplating a top terminal metal plane and a bottom terminal metal plane onto the first polarity electrode and the second polarity electrode of the vertical capacitor element, and the via

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS12347628B1Stackable and embeddable vertical capacitors in semiconductor devices and method of fabrication
Publication Date: 2025.07.01 SARAS MICRO DEVICES INC
  • US12347628B1 patent drawing
  • US12347628B1 patent drawing
  • US12347628B1 patent drawing

AI summary

A stackable, embeddable capacitor has one or more first type vertical capacitor elements, each of which has a top cathode, a bottom anode, and a first orientation central capacitance region between the top cathode and the bottom anode. The capacitor also has one or more second type vertical capacitor elements, each of which has a bottom cathode, a top anode, and a second orientation central capacitance region between the bottom cathode and the top anode. The second type vertical capacitor elements are alternatingly stacked on the first type vertical capacitor elements.