Stage Embedded Member Suppressing Abnormal Discharge
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Solution Overview
Problem
Existing substrate processing apparatuses experience abnormal discharge issues due to electrical potential differences during high-frequency power application, which can lead to plasma discharge and affect the etching process.
Innovation Solution
Incorporating an embedded member with a labyrinth structure and protrusions within the through hole of the stage, which reduces the inter-electrode distance and increases the discharge initiation voltage, thereby suppressing abnormal discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a through hole is provided in the stage for supplying heat transfer gas, then heat transfer efficiency is improved, but abnormal discharge occurs due to electrical potential differences
Solution Approach 1:
An embedded member is introduced as an intermediary component within the through hole to suppress abnormal discharge. This member acts as a mediator that reduces electrical potential differences between the stage and ground, preventing discharge while allowing heat transfer gas to flow through the surrounding gap.
Solution Approach 2:
The electrical potential distribution parameter is changed by introducing the embedded member with specific electrical properties. This alters the electrical field configuration within the through hole, increasing the discharge initiation voltage and suppressing abnormal discharge while maintaining thermal transfer functionality.
2Power
If high-frequency power is applied to the stage, then plasma generation is improved, but abnormal discharge and plasma discharge occur affecting etching process
Solution Approach 1:
The embedded member provides preliminary anti-action by suppressing abnormal discharge before it can affect the etching process. It preemptively reduces electrical potential differences that would otherwise lead to harmful discharge, ensuring stable plasma processing conditions.
3Productivity
If the through hole is left open for gas flow, then gas supply efficiency is improved, but electron acceleration distance increases causing discharge
Solution Approach 1:
The embedded member serves as an intermediary structure that simultaneously enables gas flow and suppresses electron acceleration. It creates a controlled gap for heat transfer gas while reducing the electrical field strength sufficient to prevent abnormal discharge.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents abnormal discharge by shortening the electron acceleration distance and maintaining a minimal gap between the embedded member and the through hole, ensuring stable plasma processing.
Implementation Method 1
an embedded member disposed inside the through hole, wherein at least one of a concave portion and a convex portion is provided on a surface of the embedded member... it is possible to suppress abnormal discharge in a stage
Data Source
AI summary
The present invention provides a stage which comprises: a plate-shaped member having a mounting surface on which a workpiece to be processed is mounted and a rear surface facing the mounting surface, said plate-shaped member being provided with a through hole that penetrates through the mounting surface and the rear surface; and an embedded member disposed inside the through hole. This stage is configured such that the surface of the embedded member is provided with at least one of a concave portion and a convex portion.


