Stage Protection During Pre-Sputtering Without Mask Interference
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Solution Overview
Problem
In semiconductor manufacturing, the existing methods for protecting the stage during pre-sputtering delay the start of substrate processing, as frequent replacement of protective members is needed due to plasma exposure, leading to reduced throughput and potential interference between the protective member and the mask.
Innovation Solution
A processing method and apparatus that uses a disc shutter with a thickness different from the substrate, mounted on the stage before the transfer system starts, to protect the stage during pre-sputtering, adjusting the distance between the stage and the mask to prevent interference and allow for initial processing without delaying the substrate transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective member is mounted on the stage to protect it during pre-sputtering, then the stage is protected from plasma damage, but the protective member may interfere with the mask and requires frequent replacement
Solution Approach 1:
The protective member (disc shutter) is mounted on the stage in advance before the transfer system starts operation, enabling pre-sputtering to begin immediately without waiting for substrate transfer. This preliminary preparation eliminates the delay between system startup and processing commencement.
Solution Approach 2:
The distance between the stage and mask is dynamically adjusted based on the thickness of the mounted object. When a protective member with different thickness than the substrate is mounted, the stage-to-mask distance is modified to prevent interference between the protective member and mask, allowing flexible adaptation to different mounting scenarios.
2Productivity
If the protective member thickness matches the substrate thickness, then interference with the mask is minimized, but the protective member must be frequently replaced due to plasma damage
Solution Approach 1:
The thickness parameter of the protective member is changed to be greater than the substrate thickness. This modification allows the protective member to withstand plasma exposure for longer periods without damage, reducing replacement frequency. The accompanying adjustment of stage-to-mask distance compensates for the thickness difference to maintain proper spacing.
3Loss of time
If pre-sputtering is performed before substrate transfer, then processing can start immediately, but the protective member may interfere with the mask
Solution Approach 1:
The protective member is prepared and mounted on the stage in advance, before the transfer system operates and before pre-sputtering begins. This preliminary setup enables immediate commencement of pre-sputtering without waiting for substrate transfer, eliminating processing delays.
Solution Approach 2:
The stage-to-mask distance is dynamically adjusted according to the protective member thickness to prevent interference. By modifying this distance parameter, the system accommodates the protective member's presence while allowing pre-sputtering to proceed without harmful interactions between the protective member and mask.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the start of substrate processing without delay, reduces damage to the stage and mask, and improves throughput by allowing pre-sputtering to begin before the transfer system operates, while minimizing interference between the protective member and the mask.
Implementation Method 1
Patent Document 1 discloses a film forming system that forms a film on a substrate by sputtering
Implementation Method 2
a pretreatment step of performing a pretreatment in the processing container to change a state in the processing container to a predetermined state
Data Source
AI summary
A processing method for processing a substrate includes: a first arrangement step of mounting, on a stage provided in a processing container to mount the substrate on the stage, a plate-shaped protective member which is prepared in advance at a location in the processing container different from a location on the stage and which is configured to protect an upper surface of the stage; an adjustment step of adjusting a distance between the stage and an annular cover member provided above an edge portion of the stage to a second distance different from a first distance between the stage and the cover member when the substrate is processed; and a pretreatment step of performing a pretreatment in the processing container to change a state in the processing container to a predetermined state, wherein the protective member has a thickness different from a thickness of the substrate.