Substrate Stage Ring Positioning for Thermal Expansion Control
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Solution Overview
Problem
In substrate processing apparatuses, the positional relationship between stage peripheral members like separation rings and stages changes with temperature, leading to gaps that are not uniformly dimensioned, affecting gas partitioning and plasma formation efficiency.
Innovation Solution
The use of a stage peripheral member with a first positioning pin fixed close to the reference position and a second positioning pin farther away, with corresponding holes that allow for controlled movement with temperature changes, maintaining a narrow gap and preventing contact between the stage and the separation ring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the processing chamber is heated to maintain stable processing conditions, then gas adsorption on chamber surfaces is prevented, but thermal expansion causes positional shifts between stage peripheral members and stages
Solution Approach 1:
The patent changes the physical state of the positioning mechanism by using an elongated hole that allows the positioning pin to move freely in the radial direction. This enables the stage peripheral member to adjust its position in response to thermal expansion of the processing chamber, maintaining proper spacing while the chamber is heated during substrate processing
Solution Approach 2:
The positioning mechanism transitions from a static fixed-position hole to a dynamic elongated hole that allows movement. The stage peripheral member can dynamically adjust its radial position based on thermal expansion conditions, ensuring consistent gap maintenance between the separation ring and stage during heating cycles
2Manufacturing precision
If the stage peripheral member is rigidly fixed to maintain precise positioning, then manufacturing precision is improved, but thermal expansion of the processing chamber causes contact between the stage and separation ring
Solution Approach 1:
The elongated hole provides a dynamic positioning mechanism that allows the stage peripheral member to move radially in response to thermal expansion. This dynamic adjustment prevents contact between the stage and separation ring while maintaining precise positioning during processing
Solution Approach 2:
The positioning hole geometry changes from a fixed circular hole to an elongated hole with extended length in the radial direction. This geometric parameter change enables the positioning pin to shift position, accommodating thermal expansion and preventing harmful contact while maintaining positioning precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the positional shift dimension of the separation ring, ensuring a consistent and narrow gap between the stage and the separation ring, enhancing gas partitioning and plasma formation efficiency during substrate processing.
Implementation Method 1
the second positioning pin moves in response to expansion and contraction of the processing chamber according to switching between a heated state by the heating unit and a non-heated state
Data Source
AI summary
A substrate processing apparatus includes: a processing chamber including a processing room; a heating unit that heats the processing chamber; a support including a base thermally isolated from the processing chamber and fixed to the processing chamber, and a stage inserted into an opening provided toward the processing room while being supported by the base at a position distant from a reference position in a horizontal direction, and holds the substrate in the processing room; a stage peripheral member provided in the processing chamber along a periphery of the stage in a state of being inserted into the opening; and a first positioning pin fixed to the processing chamber to position the stage peripheral member, and a second positioning pin fixed to a position farther than the first positioning pin.