Staggered Collimation Hole and Electrode Via in Array Substrate
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The difficulty in nesting collimation holes with electrode vias on an array substrate for under-screen fingerprint recognition is high, leading to residual photoresist and optical loss due to the complexity of the process and light reflection.
Innovation Solution
The array substrate design includes a light blocking layer with a collimation hole and an electrode connecting structure arranged in a staggered order relative to the light sensing structure, with an insulation layer providing an electrode via that connects the light sensing structure, reducing the number of layers the electrode via passes through and minimizing residual photoresist and optical loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the collimation hole and electrode via are arranged in a nested configuration (electrode via passing through the light blocking layer at the same position as the collimation hole), then the connection between electrode connecting structure and light sensing structure is achieved, but the process difficulty increases significantly and residual photoresist is generated
Solution Approach 1:
The patent transitions from a vertical nested arrangement to a horizontal staggered arrangement. The electrode via is positioned offset from the collimation hole in the planar direction, changing the spatial relationship from one dimension (vertical stacking) to another dimension (horizontal separation), thereby avoiding the nested configuration that causes manufacturing difficulties while maintaining electrical connection functionality.
Solution Approach 2:
The electrode via is extracted from the position directly beneath the collimation hole and relocated to a staggered position. This separation removes the conflicting requirement of nesting the electrode via through the light blocking layer at the same location as the collimation hole, eliminating the source of residual photoresist and process complexity while preserving the essential electrical connection function.
2Reliability
If the electrode via passes through multiple layers including the light blocking layer at the collimation hole position, then the electrode connecting structure can be connected to the light sensing structure, but optical loss increases due to light reflection
Solution Approach 1:
The electrode via is extracted from the path of light transmission by positioning it in a staggered location that does not coincide with the collimation hole. This removes the electrode via from the optical path, eliminating the light reflection and optical loss that would occur if the electrode via material interrupted or reflected light traveling through the collimation hole to reach the light sensing structure.
Solution Approach 2:
The insulation layer serves as an intermediary that allows the electrode via to provide electrical connection functionality without directly interfering with light transmission. By positioning the electrode via in the insulation layer at a staggered position, the system maintains electrical connectivity while using the insulation layer as a mediator that prevents direct interaction between the conductive electrode via material and the optical path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the fabrication process, reduces residual photoresist, and minimizes optical loss by distributing the collimation hole and electrode via in a staggered order, ensuring sufficient light intensity reaches the light sensing structure for effective fingerprint recognition.
Implementation Method 1
a light blocking layer and an electrode connecting structure arranged at a side of the light sensing structure facing away from the base substrate. The light blocking layer is provided with a collimation hole
Implementation Method 2
In the fingerprint identification unit, a photodiode is generally used as a light sensing structure
Implementation Method 3
An insulation layer is arranged between the electrode connecting structure and the light sensing structure
Data Source
AI summary
Provided are an array substrate and display device. The array substrate includes a base substrate; a fingerprint recognition unit with a light sensing structure; a light blocking layer and an electrode connecting structure arranged at a side of the light sensing structure facing away from the base substrate. The light blocking layer is provided with a collimation hole. A vertical projection of the collimation hole on the base substrate is partially overlapped with a vertical projection of the light sensing structure on the base substrate. An insulation layer is arranged between the electrode connecting structure and the light sensing structure. The insulation layer is provided with an electrode via. The electrode connecting structure is connected to the light sensing structure through the electrode via. The vertical projection of the collimation hole on the base substrate is not overlapped with a vertical projection of the electrode via on the base substrate.