High-Speed Connector Socket With Staggered Multi-Layer Pins
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current SFP high-speed connectors, including Quad Small Form-factor Pluggable (QSFP) connectors, have a long interface end and large volume due to single-row pin distribution, which limits their ability to support multiple channels of high-speed signal transmission, failing to meet the increasing bandwidth requirements of communications products.
Innovation Solution
The socket and plug for a high-speed connector feature upper-layer and lower-layer pins arranged in a staggered manner, reducing the length and volume of the socket, and allowing for efficient use of vertical space, while maintaining compatibility with SFP plugs by matching pin distribution and spacing, enabling multiple channel high-speed signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If pins are arranged in a single-row distribution in a straight line, then the connector structure is simple, but the interface end becomes long and the volume becomes large
Solution Approach 1:
The patent transitions from a single-row linear pin distribution to a multi-layer three-dimensional pin arrangement. Specifically, it uses upper-layer pins and lower-layer pins distributed on different sides of the opening inner wall, effectively moving the pin layout from one dimension (straight line) to three dimensions (multiple layers and sides), thereby reducing the length of the interface end and the overall volume of the socket.
2Device complexity
If pins are arranged in a single-row distribution in a straight line, then the connector structure is simple, but the length of the interface end becomes long
Solution Approach 1:
The patent transitions from a single-row linear pin distribution to a multi-layer three-dimensional pin arrangement. Specifically, it uses upper-layer pins and lower-layer pins distributed on different sides of the opening inner wall, effectively moving the pin layout from one dimension (straight line) to three dimensions (multiple layers and sides), thereby reducing the length of the interface end and the overall volume of the socket.
Solution Approach 2:
The patent divides the pins into multiple groups arranged in at least two rows of pin groups distributed in a staggered manner. This segmentation of pins into multiple rows and groups allows for a more compact arrangement, reducing the interface end length while maintaining the required number of connection points.
3Productivity
If a QSFP connector supports four channels of high-speed signals, then the bandwidth capability is improved, but the pin distribution requires a long interface end and large volume
Solution Approach 1:
The patent transitions from a single-row linear pin distribution to a multi-layer three-dimensional pin arrangement. Specifically, it uses upper-layer pins and lower-layer pins distributed on different sides of the opening inner wall, effectively moving the pin layout from one dimension (straight line) to three dimensions (multiple layers and sides), thereby reducing the length of the interface end and the overall volume of the socket.
Solution Approach 2:
The patent combines upper-layer pins and lower-layer pins into a unified multi-layer structure within the same socket body. This merging of pin layers allows the socket to support four channels of high-speed signals while maintaining a compact form factor, as the pins are efficiently packed in three-dimensional space rather than requiring a long linear arrangement.
Data Source
AI summary
A socket and a plug for a high-speed connector configured to implement communication and transmission of multiple channels of high-speed signals are disclosed. The socket according to an embodiment of the present invention includes: a shell and pins; the shell has an opening configured to accommodate a plug for the high-speed connector; the pins include upper-layer pins and lower-layer pins; the upper-layer pins are set at one side of an inner wall of the opening, the lower-layer pins are set at the other side of the inner wall of the opening corresponding to positions of the upper-layer pins, the upper-layer pins are arranged in at least two rows of pin groups, and the at least two rows of pin groups are distributed in a staggered manner along a length direction of the pins.