Stamp Donor Plate Structure for Uniform Micro-LED Chip Transfer
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Solution Overview
Problem
The challenge in the micro-LED display device manufacturing process is the precise and defect-free transfer of micro-LED chips from a growth substrate to a panel substrate, especially as chip sizes decrease, requiring advanced technologies to ensure high precision and reliability.
Innovation Solution
A stamp donor plate with a specific structure featuring protrusions and air flow passages is used to accurately transfer micro-LED chips onto a panel substrate, minimizing defects through controlled detachment and air flow management, allowing for high-resolution display device production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro-LED chips are transferred using conventional methods, then the transfer process is simple, but the precision and reliability of chip placement deteriorates as chip size decreases
Solution Approach 1:
The patent introduces a stamp structure as an intermediary tool between the growth substrate and panel substrate. The stamp structure includes multiple protrusions that contact the micro-LED chips, enabling precise transfer of small chips without direct contact methods. This intermediary mechanism resolves the contradiction by providing controlled, precise transfer while maintaining process feasibility.
Solution Approach 2:
The patent utilizes air flow passages integrated into the stamp structure to apply controlled air pressure during the transfer process. This pneumatic mechanism enables precise positioning and transfer of micro-LED chips by controlling the air flow through specific passages, achieving high precision placement without excessive mechanical complexity.
2Manufacturing precision
If the stamp structure uses uniform protrusions, then the structure is simple, but the transfer quality deteriorates due to uneven pressure distribution
Solution Approach 1:
The patent implements local quality by varying the dimensions of air flow passages in different regions of the stamp structure. Specifically, the air flow passages have different widths at different locations to compensate for pressure distribution variations. This ensures uniform contact pressure across all micro-LED chips during transfer, resolving the contradiction between transfer uniformity and structural simplicity.
3Reliability
If air flow passages are not optimized, then the stamp structure is simple, but defects such as tilt and flip occur during chip transfer
Solution Approach 1:
The patent optimizes the air flow passage parameters, specifically varying the width of passages based on their position in the stamp structure. This parameter optimization ensures proper air flow distribution that prevents defects like tilt and flip during chip transfer. The controlled air flow parameters achieve reliable, defect-free transfer while maintaining reasonable structural complexity.
Data Source
AI summary
A stamp donor plate includes a stamp donor plate substrate including an inner area and an outer area surrounding the inner area; and a stamp structure disposed on the stamp donor plate substrate, wherein the stamp structure includes a plurality of protrusions, wherein the plurality of protrusions include a plurality of first protrusions arranged on an inner area, and a plurality of second protrusions arranged on the outer area.