Stamped Design Layer Component Carrier for Embedded Connection Precision

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Solution Overview

Problem

Manufacturing electrically conductive connection structures on component carriers, particularly those with embedded components, is challenging due to the need for high precision and simplicity, especially in ensuring mechanical robustness and electrical reliability under harsh conditions.

Innovation Solution

A component carrier with a stack of electrically conductive and insulating layer structures, featuring a design layer with a stamped surface profile, allows for precise embedding of components, enabling high-accuracy electrical connections and heat dissipation through a stamped design layer structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional manufacturing methods are used for electrically conductive connection structures, then manufacturing simplicity is maintained, but manufacturing precision deteriorates

Engineering Contradiction:

Improveprecision of electrically conductive connection structuresVSAvoidsimplicity of manufacturing process

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The design layer structure is stamped with the desired surface profile before component embedding, pre-defining the precise locations and geometries of electrically conductive connection structures. This preliminary structuring enables high-precision connections without requiring complex subsequent manufacturing steps, as the stamping process simultaneously creates alignment features, connection pathways, and structural guides for component placement.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If component spacing is reduced to increase functionality, then product functionality is improved, but heat dissipation becomes more difficult

Engineering Contradiction:

Improveproduct functionalityVSAvoidheat dissipation

Core Design Contradiction:

Adaptability or versatilityVSTemperature

Solution Approach 1:

The design layer structure extends vertically with three-dimensional stamped profiles that create multiple elevation levels and pathways. This dimensional complexity allows heat to be dissipated through vertical channels and surfaces in addition to horizontal paths, effectively managing thermal loads from closely spaced components by utilizing the third dimension for heat flow.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If component spacing is reduced to increase functionality, then product functionality is improved, but mechanical robustness deteriorates

Engineering Contradiction:

Improveproduct functionalityVSAvoidmechanical robustness

Core Design Contradiction:

Adaptability or versatilityVSStrength

Solution Approach 1:

The design layer structure functions as a composite framework integrating multiple functions: mechanical support, electrical connection pathways, thermal management channels, and alignment features. This composite structure provides enhanced mechanical robustness despite reduced component spacing, as the integrated design layer distributes and manages multiple physical demands simultaneously rather than requiring separate structures for each function.

Inventive Principle:

Principle #40Composite materials

Data Source

PatentUS20250349727A1Component Carrier With Stamped Design Layer Structure and Embedded Component

Publication Date: 2025.11.13 AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AG

AI summary

A component carrier includes a stack-having at least one electrically conductive layer structure and at least one electrically insulating layer structure where the at least one electrically insulating layer structure has at least one design layer structure with a stamped surface profile. A component embedded in the stack-is at least partially covered by the at least one design layer structure.