Standard Cell Column Layout for Dense Semiconductor Memory Peripherals

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Solution Overview

Problem

As semiconductor devices downscale, achieving high integration and low power consumption requires efficient arrangement and interconnection of standard cells, which is challenging due to reduced cell sizes and pattern widths.

Innovation Solution

The semiconductor device optimizes area and performance by arranging standard cells in columns of varying heights, with at least one peripheral column having a different cell height than others, allowing for optimized integration and performance in the peripheral circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If standard cell size is reduced to achieve high integration, then integration density is improved, but arrangement efficiency and interconnection become more difficult

Engineering Contradiction:
Improveintegration densityVSAvoidarrangement complexity
Core Design Contradiction:
Quantity of substanceVSDevice complexity

Solution Approach 1:

The peripheral region is divided into multiple column groups (first peripheral column group, second peripheral column group, etc.) with different heights. Each column group contains standard cells of uniform height, allowing efficient arrangement while achieving high overall integration density through the heterogeneous mix of column group heights.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different column groups are assigned different heights based on local requirements. The first peripheral column group has a first height, while the second peripheral column group has a second height different from the first, optimizing the arrangement for specific functional needs in different regions of the peripheral circuit.

Inventive Principle:
Principle #3Local quality

2Use of energy by moving object

If standard cell size is reduced to achieve low power consumption, then power efficiency is improved, but interconnection efficiency deteriorates

Engineering Contradiction:
Improvepower consumptionVSAvoidinterconnection efficiency
Core Design Contradiction:
Use of energy by moving objectVSProductivity

Solution Approach 1:

The patent introduces height as an additional dimension for organizing standard cells beyond the traditional two-dimensional plane. By varying the height of column groups, the patent creates a three-dimensional arrangement space that improves interconnection efficiency while maintaining reduced cell sizes for low power consumption.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The peripheral circuit is segmented into multiple column groups with different heights, allowing for optimized interconnection within each segment while maintaining overall compactness. This segmentation enables efficient routing and reduces interconnection complexity despite reduced standard cell dimensions.

Inventive Principle:
Principle #1Segmentation

3Ease of manufacture

If all peripheral columns have uniform cell height, then manufacturing is simplified, but area optimization and performance are limited

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidperipheral region area
Core Design Contradiction:
Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent applies local quality by assigning different heights to different column groups based on their specific functional requirements. The first peripheral column group has a first height optimized for its functions, while the second peripheral column group has a second height optimized for its functions, achieving area optimization without compromising manufacturing feasibility.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent introduces asymmetry in the heights of peripheral column groups to optimize area utilization. By having column groups with different heights rather than uniform heights, the design achieves better area efficiency and performance while remaining manufacturable through standardized fabrication processes.

Inventive Principle:
Principle #4Asymmetry

Data Source

PatentUS12165701B2Semiconductor device including standard cells
Publication Date: 2024.12.10 SAMSUNG ELECTRONICS CO LTD
  • US12165701B2 patent drawing
  • US12165701B2 patent drawing
  • US12165701B2 patent drawing

AI summary

A semiconductor device includes a first memory column group including a plurality of memory columns in which a plurality of bit cells are disposed; and a first peripheral column group including a plurality of peripheral columns in which a plurality of standard cells are disposed, wherein the plurality of standard cells are configured to perform an operation of reading/writing data from/to the plurality of bit cells through a plurality of bit lines, wherein the first memory column group and the first peripheral column group correspond to each other in a column direction, and wherein at least one of the plurality of peripheral columns has a cell height different from cell heights of the other peripheral columns, the cell height being measured in a row direction in which a gate line is extended.