Standardized FPGA Logic Drive With NVM for Low-NRE Custom Logic

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Solution Overview

Problem

The high Non-Recurring Engineering (NRE) costs and complexity associated with designing and manufacturing Application Specific IC (ASIC) or Customer-Owned Tooling (COT) chips, especially at advanced technology nodes, hinder innovation and increase barriers for implementing new semiconductor technologies.

Innovation Solution

A standardized commodity logic drive is introduced, comprising multiple FPGA IC chips and non-volatile memory IC chips, which can be field-programmed for various applications. This approach reduces NRE costs by allowing developers to purchase standardized logic drives and write software codes for specific applications, rather than designing and manufacturing custom ASIC or COT chips.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If ASIC or COT chips are designed and manufactured for specific applications, then performance and efficiency are improved, but NRE costs and manufacturing complexity increase significantly

Engineering Contradiction:
Improveapplication performanceVSAvoiddesign and manufacturing complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent applies universality by using FPGA chips that can be reconfigured for multiple different applications through field programming. Instead of manufacturing dedicated ASIC chips for each specific application, a single universal FPGA platform can be programmed to perform various logic functions, thereby reducing NRE costs and manufacturing complexity while maintaining application-specific performance when needed.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If FPGA IC chips are used for specific applications, then design flexibility and adaptability are improved, but chip size, power consumption, and fabrication cost increase compared to ASIC

Engineering Contradiction:
Improveapplication adaptabilityVSAvoidsemiconductor material usage
Core Design Contradiction:
Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

The patent applies dynamics by enabling the FPGA chip configuration to change in the field through programming. The logic circuit structure is not fixed during manufacturing but can be dynamically reconfigured after deployment to match specific application requirements. This allows a single physical chip to adapt its logic structure dynamically, reducing the need for multiple specialized chips and thereby reducing overall semiconductor material usage.

Inventive Principle:
Principle #15Dynamics

3Productivity

If advanced technology nodes (below 30nm) are used for ASIC design, then performance is improved, but NRE costs increase dramatically

Engineering Contradiction:
Improveprocessing performanceVSAvoidmanufacturing accessibility
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

The patent applies copying by using standardized FPGA chip designs that can be replicated and programmed for different applications. Instead of incurring high NRE costs for custom ASIC design at advanced nodes, the same standardized FPGA architecture can be copied and programmed to implement different logic functions. This eliminates the need for expensive photo mask sets and custom fabrication processes while still leveraging advanced semiconductor technology for performance.

Inventive Principle:
Principle #26Copying

Data Source

PatentUS20250118721A1Logic drive based on standardized commodity programmable logic semiconductor IC chips
Publication Date: 2025.04.10 ICOMETRUE CO LTD
  • US20250118721A1 patent drawing
  • US20250118721A1 patent drawing
  • US20250118721A1 patent drawing

AI summary

A chip package includes an interposer comprising a silicon substrate, multiple metal vias passing through the silicon substrate, a first interconnection metal layer over the silicon substrate, a second interconnection metal layer over the silicon substrate, and an insulating dielectric layer over the silicon substrate and between the first and second interconnection metal layers; afield-programmable-gate-array (FPGA) integrated-circuit (IC) chip over the interposer; multiple first metal bumps between the interposer and the FPGA IC chip; a first underfill between the interposer and the FPGA IC chip, wherein the first underfill encloses the first metal bumps; a non-volatile memory (NVM) IC chip over the interposer; multiple second metal bumps between the interposer and the NVM IC chip; and a second underfill between the interposer and the NVM IC chip, wherein the second underfill encloses the second metal bumps.