Stencil Printing for Printed Circuit Board Manufacturing
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Solution Overview
Problem
Traditional printed circuit board manufacturing processes are time-consuming and generate pollution due to the inclusion of steps like copper deposition, circuit diagram transfer, electroplating, film stripping, etching, tin stripping, and solder resist pattern transfer.
Innovation Solution
A stencil printing method using multiple stencils, a scraper, and specific inks or pastes is employed to form circuit diagrams, solder mask layers, and other features directly on the circuit board, bypassing the aforementioned steps, with stencils being trepanned to precise thickness and mesh patterns for material distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manufacturing steps (copper deposition, electroplating, etching, film stripping) are used, then complete circuit board features are achieved, but manufacturing time increases and pollution is generated
Solution Approach 1:
The patent extracts and eliminates unnecessary traditional manufacturing steps (copper deposition, electroplating, etching, film stripping, tin stripping) from the process, retaining only the essential stencil printing step to form circuit patterns, thereby reducing manufacturing time while maintaining feature completeness
Solution Approach 2:
The patent skips multiple intermediate traditional manufacturing steps by directly applying conductive ink through stencil printing to form complete circuit patterns in one step, rushing through the manufacturing process to achieve rapid production without sacrificing quality
2Manufacturing precision
If traditional manufacturing steps (electroplating, etching, film stripping) are used, then circuit board features are formed, but pollution is generated
Solution Approach 1:
The patent removes pollution-generating steps (electroplating, etching, film stripping) from the manufacturing process, keeping only the environmentally friendly stencil printing method that uses conductive ink without harmful chemicals
Solution Approach 2:
The patent replaces harmful traditional processes with a beneficial alternative: using non-toxic conductive ink and stencil printing instead of polluting electroplating and etching processes, converting a potentially harmful manufacturing approach into an environmentally friendly one
3Reliability
If multiple traditional steps (copper deposition, electroplating, tin deposition) are performed, then complete circuit board functionality is achieved, but process complexity increases
Solution Approach 1:
The patent merges multiple traditional separate steps (copper deposition, circuit pattern formation, tin deposition) into a single integrated stencil printing process that applies conductive ink containing both conductive and solderable materials, simplifying the manufacturing process while maintaining complete circuit board functionality
Solution Approach 2:
The patent uses a universal conductive ink formulation that provides both electrical conductivity and solderability in one material, and a universal stencil printing process that performs multiple functions (pattern formation, material deposition, and surface preparation), eliminating the need for multiple specialized steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces manufacturing time and pollution by directly applying conductive and solder materials through stencils, allowing for efficient and clean production of printed circuit boards.
Implementation Method 1
The stencil includes a silkscreen, a steel disc, and a frame. The silkscreen is pasted on the steel disc by bonding glues. The steel disc is made from stainless steel. In the illustrated embodiment, the steel disc can be trepanned by means of laser cutting, chemical etching, or electroforming.
Implementation Method 2
The scraper moves the conductive inks around between the end having the conductive inks and the other end. The conductive inks are extruded to the circuit board from the holes of the first stencil by the scraper
Data Source
AI summary
A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.