Unit Pixel Structure With Step Adjustment for Micro LED Mounting
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Solution Overview
Problem
Micro LED displays face challenges in handling and mounting small light emitting diodes due to their tiny size, making it difficult to directly integrate them onto display panels effectively.
Innovation Solution
A unit pixel design featuring a transparent substrate with light emitting devices, an adhesive layer, a step adjusting layer with a concave-convex pattern, and connection layers, which allows for stable mounting on a circuit board and efficient light emission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro LEDs are made extremely small (200 μm or less, further 100 μm or less) to increase pixel density, then display resolution is improved, but handling and mounting difficulty increases significantly
Solution Approach 1:
The patent divides the micro LED array into modular units, each containing multiple sub-pixels (red, green, blue) arranged in a standardized configuration. This segmentation allows the entire array to be manufactured as a complete module rather than handling individual micro LEDs, solving the handling difficulty while maintaining high pixel density through precise modular arrangement.
Solution Approach 2:
The patent introduces a transfer substrate as an intermediary carrier that holds the manufactured micro LED array during the transfer process. This intermediary enables the entire array to be moved and mounted as a single unit rather than handling individual micro LEDs, resolving the mounting difficulty while preserving the high density achieved during manufacturing.
2Manufacturing precision
If a large number of micro LEDs are arranged on a single substrate to achieve high resolution, then display quality is improved, but the complexity of direct mounting increases
Solution Approach 1:
The patent segments the high-resolution display into multiple transfer substrates, each containing a manageable array of micro LEDs. This allows the complex high-resolution array to be broken down into smaller, more manageable modules that can be manufactured and mounted separately, then assembled into the complete display.
Solution Approach 2:
The patent performs preliminary manufacturing and testing of complete micro LED arrays on transfer substrates before final mounting. This preliminary action includes forming the entire array with all sub-pixels, conducting quality checks, and preparing the array for transfer, thereby simplifying the final mounting process while achieving high display resolution.
3Ease of manufacture
If individual micro LEDs are handled and mounted directly, then device integration is achieved, but reliability decreases due to handling damage
Solution Approach 1:
The patent merges multiple individual micro LEDs into a complete array that is manufactured and handled as a single integrated unit on the transfer substrate. This combining approach eliminates the need to handle individual micro LEDs, thereby preventing handling damage while achieving the required device integration for the display.
Solution Approach 2:
The patent performs preliminary formation and quality verification of the complete micro LED array on the transfer substrate before final mounting. This preliminary action ensures that only fully functional arrays are transferred and mounted, improving reliability by preventing defective devices from being integrated into the final display.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable and efficient mounting of light emitting devices on a circuit board, preventing failed devices and improving the reliability and performance of micro LED displays.
Implementation Method 1
an adhesive layer bonding the light emitting devices to the transparent substrate
Data Source
AI summary
A displaying apparatus including a panel substrate and pixel modules arranged thereon, each pixel module including a circuit board and unit pixels on the circuit board, in which each unit pixel includes light emitting devices longitudinally extending along a first direction on the circuit board and including a substrate, a light emitting structure including first and second conductivity type semiconductor layers and an active layer therebetween, a first connection layer electrically connected to the first conductivity type semiconductor layer, a second connection layer electrically connected to the second conductivity type semiconductor layer, a step adjustment layer disposed between the first connection layer and the second connection layer and covering a portion of the light emitting device, in which the light emitting devices in the unit pixel are arranged in a second direction crossing the first direction.