Stepped Die Stack Bonding Wire Layout for Compact Semiconductor Packages
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Solution Overview
Problem
The challenge is to create a semiconductor package that efficiently connects multiple semiconductor die stacks while minimizing size and ensuring reliable electrical connections.
Innovation Solution
The semiconductor package includes a lower and upper semiconductor die stack stacked in a stepwise manner, with bonding wire groups connecting the dies to a wiring structure. The bonding wire groups feature curved, upward, inclined, and additional upward wires to facilitate efficient connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor dies are stacked vertically to reduce package size, then the package volume is reduced, but the complexity of connecting multiple dies to the wiring structure increases
Solution Approach 1:
The bonding connections are segmented into multiple functional groups: first bonding wire groups connecting lower dies, second bonding wire groups connecting upper dies, and third bonding wire groups providing additional connections. This segmentation allows each group to handle specific connection tasks, reducing overall complexity while enabling vertical stacking of multiple semiconductor dies.
Solution Approach 2:
The patent transitions from planar packaging to three-dimensional vertical stacking by extending bonding connections in the vertical dimension. Multiple bonding wire groups are arranged at different heights and positions to connect dies stacked in the thickness direction, effectively utilizing spatial dimensions to reduce package footprint while managing connection complexity.
2Adaptability or versatility
If multiple bonding wire groups are used to connect all semiconductor dies, then the connectivity is improved, but the device complexity increases
Solution Approach 1:
The bonding wire groups serve multiple functions: they provide electrical connections between dies and the wiring structure, mechanically support the stacked dies, and enable both lower and upper dies to be connected through a unified bonding architecture. This multi-functionality reduces the need for separate specialized structures for each function.
Solution Approach 2:
Multiple bonding wire groups are merged into a coordinated system where first, second, and third bonding wire groups work together to connect all semiconductor dies to the wiring structure. The bonding portions are combined in a structured arrangement that achieves comprehensive connectivity while avoiding redundant individual connections.
3Area of stationary object
If the semiconductor dies are arranged in a compact stacked configuration, then the package area is reduced, but the ease of manufacturing decreases
Solution Approach 1:
The bonding wire groups and their bonding portions are preliminarily arranged in specific patterns before final die stacking. The first bonding portions connect lower dies, second bonding portions connect upper dies, and third bonding portions provide additional connections, establishing a pre-planned connection architecture that guides the manufacturing process and simplifies assembly.
Solution Approach 2:
The bonding wire groups are nested within the three-dimensional space between and around the stacked semiconductor dies. The bonding portions are positioned to efficiently utilize the available space, with wires routing through and around dies in a nested arrangement that achieves compact packaging while maintaining manufacturability through systematic wire placement.
Data Source
AI summary
A semiconductor package includes a lower semiconductor die stack in which lower semiconductor dies are stacked vertically in a stepwise manner to extend in a first horizontal direction, an upper semiconductor die stack in which upper semiconductor dies are stacked vertically on the lower semiconductor die stack in a stepwise manner to extend in a first reverse horizontal direction, a wiring structure above the upper semiconductor die stack, and bonding wire groups connecting the lower semiconductor dies and the upper semiconductor dies to the wiring structure. The bonding wire groups include a first bonding wire group that includes bonding wires that connect a first plurality of semiconductor dies of the upper and lower semiconductor dies to the wiring structure. The bonding wire group includes a first curved wire connecting a second plurality of semiconductor dies of the first plurality of semiconductor dies, a first upward wire connected to the first curved wire, a first inclined wire connected to the first upward wire, and a second upward wire to connect the first inclined wire to the wiring structure.