Stepped Through-Hole Openings for Reliable Electronic Interconnects
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Solution Overview
Problem
The existing manufacturing processes for electronic devices face challenges in forming through holes with reduced defects, particularly due to the large thickness and different material properties of insulating layers, which can lead to reliability issues in electrical connections.
Innovation Solution
A manufacturing method that involves forming a substrate with a conductive layer and a circuit structure, including a dielectric layer with a stepped profile, to create openings for bonding pads, which allows for precise electrical connections and reduces the risk of defects by using a combination of etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple insulating layers with different materials and large thickness are used in the electronic device, then the device functionality and electrical isolation are improved, but the reliability of through holes is reduced due to increased defect possibility
Solution Approach 1:
The through hole formation process is segmented into multiple etching stages, each targeting specific insulating layers with different etching conditions. This allows precise control over etching depth and profile for each layer type, reducing defects caused by varying material properties and thicknesses.
Solution Approach 2:
Etching parameters such as etchant composition, temperature, and processing time are dynamically adjusted based on the specific insulating layer being etched. This enables optimized etching rates and hole quality for each layer, minimizing defects despite material and thickness variations.
2Reliability
If the insulating layers have large thickness and different material properties, then the electrical isolation and device performance are improved, but the etching process complexity increases leading to more defects
Solution Approach 1:
The etching process is divided into sequential steps, with each step designed to selectively etch specific insulating layers. This segmentation simplifies the overall complex process by breaking it into manageable stages, each with optimized parameters for specific materials.
Solution Approach 2:
Etch stop layers or barrier layers are introduced as intermediary structures between different insulating layers. These intermediaries facilitate controlled etching by providing distinct etching endpoints and preventing over-etching, thereby reducing process complexity and defect rates.
3Ease of manufacture
If conventional etching processes are used on thick multi-material insulating layers, then the manufacturing process is simple, but the defect rate in through holes increases reducing device reliability
Solution Approach 1:
The etching process is segmented into multiple controlled stages rather than a single step, maintaining ease of manufacture through standardized process modules while improving through hole quality by addressing each insulating layer's specific etching requirements.
Solution Approach 2:
Etching parameters are systematically changed between stages to match the material properties of different insulating layers. This maintains manufacturing simplicity through automated parameter adjustment while significantly reducing defect rates through material-specific optimization.
Data Source
AI summary
A manufacturing method of an electronic device is provided, which includes following steps. A substrate is provided. A conductive layer is formed on the substrate. A circuit structure is formed on the conductive layer. The circuit structure is patterned to form at least one opening. The at least one opening has a stepped profile. An electronic device is also provided.