Stepped Through Slots for Miniaturized Display Soldering Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display technologies face challenges in miniaturization due to issues with soldering performance and space constraints, making it difficult to achieve smaller, high-performance LED devices with consistent color and improved packaging quality.
Innovation Solution
A display device with a circuit substrate featuring stepped through slots and a packaging material with nanoscale matte particles, along with a manufacturing method that includes a conductive frame with interconnected circuit substrates and sequential light-emitting elements for improved moisture resistance, energy efficiency, and reduced heat conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the cutting size is smaller to achieve miniaturization, then the display device size is reduced, but the soldering performance deteriorates because soldering spots are closer to edges
Solution Approach 1:
The patent introduces a stepped through-slot structure that creates vertical dimensionality in the circuit substrate. The through-slot has different opening sizes at the first surface (larger) and second surface (smaller), forming steps that extend in the thickness direction. This dimensional change allows soldering spots to be positioned away from the edge while maintaining small overall device footprint, thus preserving soldering performance during miniaturization.
2Ease of manufacture
If more space is reserved for cutting in the manufacturing process, then the manufacturing feasibility is improved, but the available space for die bonding and wiring is reduced
Solution Approach 1:
The through-slot structure implements local quality differentiation by having larger openings at the first surface and smaller openings at the second surface. This localized variation in slot dimensions allows the slot to serve multiple functions: providing adequate cutting space during manufacturing while minimizing the space occupied in the final device structure, thereby preserving area for die bonding and wiring.
3Device complexity
If conventional flat through-slots are used, then the manufacturing process is simpler, but the anti-moisture ability and packaging quality are insufficient
Solution Approach 1:
The patent transitions from conventional flat two-dimensional through-slots to a three-dimensional stepped structure. The through-slot extends through the thickness of the circuit substrate with varying opening sizes, creating steps that provide enhanced moisture barrier pathways and improved packaging quality while maintaining manufacturing feasibility.
4Ease of manufacture
If light-emitting elements are arranged in traditional configurations, then the manufacturing is easier, but color inconsistency occurs and display uniformity deteriorates
Solution Approach 1:
The patent incorporates a feedback mechanism where the stepped through-slot structure influences the positioning and arrangement of light-emitting elements. The specific geometric constraints of the stepped slots provide implicit feedback that guides the precise placement of red, green, and blue LEDs, ensuring optimal spacing and alignment that prevents color inconsistency and achieves uniform display characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the creation of small-sized display devices with enhanced anti-moisture ability, reduced energy consumption, improved heat dissipation, and increased packaging quality, while preventing color inconsistency and reflecting less light for better contrast.
Implementation Method 1
The packaging material includes a resin matrix and a plurality of nanoscale matte particles dispersed in the resin matrix... reflecting less light for better contrast
Implementation Method 2
The through slots each are stepped in form... extending in the thickness direction of the circuit substrate... enhanced anti-moisture ability
Data Source
AI summary
A display device and a manufacturing method thereof are provided. The display device includes a circuit substrate, multiple light-emitting elements and a packaging material. The circuit substrate includes a first surface, a second surface opposite the first surface, and multiple through slots penetrating through the first and second surfaces. The through slots each are in a stepped form, and the circuit substrate is divided into a chip mounting area, multiple anodes, and a common cathode. The light-emitting elements include multiple light-emitting elements mounted on the circuit substrate along a straight line and electrically connected with the anodes respectively through wires. The packaging material covers the circuit substrate, the light-emitting elements and the wires. The display device has an excellent performance while achieving a small size.