Thin-Film Storage Transistor Band Engineering for Cool Electron Erase

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Solution Overview

Problem

Existing thin-film storage transistors face endurance issues due to programming window narrowing and degradation caused by hot holes generated during erase operations, which affect data retention and cycle longevity.

Innovation Solution

A storage transistor structure is designed with a tunnel dielectric layer and a charge-trapping layer having specific conduction band offsets, along with a barrier layer, to facilitate direct tunneling of 'cool electrons' during programming and erase operations, reducing energy loss and hot hole generation, thereby enhancing endurance beyond 10^11 cycles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If fast programming and erase operations are implemented using high current density, then programming and erase speed is improved, but device degradation and hot hole generation increase, reducing endurance

Engineering Contradiction:
Improveprogramming and erase speedVSAvoidendurance
Core Design Contradiction:
SpeedVSReliability

Solution Approach 1:

The patent changes the energy parameter of electrons by using a specific conduction band offset configuration in the charge-trapping layer. This allows electrons to tunnel with reduced energy loss, transforming high-energy electrons into low-energy electrons during erase operations, thereby reducing hot hole generation while maintaining fast erase speeds

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs a composite dielectric structure consisting of a tunnel dielectric layer and a charge-trapping layer with specific materials (e.g., silicon nitride, silicon oxynitride) having tailored conduction band offsets. This composite structure enables selective electron tunneling with minimized energy loss, achieving both high speed and high endurance

Inventive Principle:
Principle #40Composite materials

2Speed

If high current density is used for fast erase operations, then erase speed is improved, but programming window narrowing occurs due to hot hole generation, worsening data retention

Engineering Contradiction:
Improveerase speedVSAvoidprogramming window narrowing
Core Design Contradiction:
SpeedVSLoss of information

Solution Approach 1:

The patent modifies the energy parameter of electrons during erase operations by engineering the conduction band offset of the charge-trapping layer. This parameter change ensures that electrons lose minimal energy during tunneling, preventing hot hole generation that would otherwise cause programming window narrowing and data retention issues

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent converts the potentially harmful high-energy electron tunneling process into a beneficial low-energy process by using the conduction band offset configuration. The charge-trapping layer acts as an energy filter, allowing electrons to tunnel efficiently while preventing the generation of harmful hot holes, thus protecting the programming window

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution achieves high endurance by maintaining a substantial direct tunneling current density while minimizing device degradation, ensuring reliable data retention and improved performance in quasi-volatile storage transistors.

Implementation Method 1

electrons direct tunnel into the charge-trapping layer

Methodology Applied
Scientific EffectDirect tunneling:

Data Source

PatentUS12183834B2Cool electron erasing in thin-film storage transistors
Publication Date: 2024.12.31 SUNRISE MEMORY CORP
  • US12183834B2 patent drawing
  • US12183834B2 patent drawing
  • US12183834B2 patent drawing

AI summary

A storage transistor has a tunnel dielectric layer and a charge-trapping layer between a channel region and a gate electrode, wherein the charge-tapping layer has a conduction band offset that is less than the lowering of the tunneling barrier in the tunnel dielectric layer when a programming voltage is applied, such that electrons direct tunnel into the charge-trapping layer. The conduction band of the charge-trapping layer has a value between −1.0 eV and 2.3 eV. The storage transistor may further include a barrier layer between the tunnel dielectric layer and the charge-trapping layer, the barrier layer having a conduction band offset less than the conduction band offset of the charge-trapping layer.