Memory Subsystem Read Calibration Using Stored Write Temperature

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Solution Overview

Problem

Existing memory devices face reliability issues due to cross-temperature effects, which cause bit flip errors and increased error rates, leading to reduced data retention and increased latency and complexity in error correction operations.

Innovation Solution

The memory device stores the write temperature along with the data and uses this information to adjust read operation parameters, compensating for cross-temperature variations to reduce errors and latency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If cross-temperature compensation is implemented by storing write temperature and adjusting read parameters, then reliability is improved, but device complexity increases

Engineering Contradiction:
Improvedata retentionVSAvoiderror correction operations
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by storing the write temperature information together with the data during the write operation. This pre-stored temperature information is then used during read operations to determine appropriate read voltage offsets, eliminating the need for complex real-time temperature sensing and calculation during reads, thus improving reliability while controlling complexity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent changes the read voltage offset parameter based on the stored write temperature and current read temperature. By adjusting this electrical parameter dynamically according to temperature conditions, the system compensates for cross-temperature effects and improves data retrieval reliability without requiring fundamental architectural changes.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If cross-temperature compensation is implemented by storing write temperature and adjusting read parameters, then reliability is improved, but latency increases

Engineering Contradiction:
Improveerror ratesVSAvoidread operation latency
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

By pre-storing the write temperature information with the data, the patent eliminates the need for complex real-time temperature sensing and calculation during read operations. The controller can directly use the stored temperature information to determine the appropriate read voltage offset, reducing computational overhead and latency while maintaining improved reliability.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If read voltage offset is adjusted based on temperature information, then manufacturing precision is improved, but device complexity increases

Engineering Contradiction:
Improveread operation parametersVSAvoidtemperature tracking
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent stores the write temperature information during the write operation, creating a preliminary record that eliminates the need for complex real-time temperature sensing and tracking during read operations. This pre-captured temperature data simplifies the overall system architecture while enabling precise read voltage offset adjustments.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS12380931B2Cross-temperature compensation in a memory sub-system
Publication Date: 2025.08.05 MICRON TECHNOLOGY INC
  • US12380931B2 patent drawing
  • US12380931B2 patent drawing
  • US12380931B2 patent drawing

AI summary

Control logic in a memory device receives, from a requestor, a request to read data from the memory array, the request comprising an indication of a segment of the memory array where the data is stored and performs, using previously configured read operation parameters, a first read operation to read the data and a write temperature associated with the data from the memory array. The control logic determines whether the previously configured read operation parameters satisfy a temperature criterion and responsive to determining that the previously configured read operation parameters do not satisfy the temperature criterion, configures the memory device with updated read operation parameters, and performs, using the updated read operation parameters, a second read operation to read the data from the memory array.