Straight-through Heat Dissipation Structure for Vacuum Chamber Integrity
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Solution Overview
Problem
Conventional vapor chambers face issues with maintaining airtightness and vacuum state after perforation, especially in ultra-thin designs, leading to thermal resistance and potential fluid leakage, and are not suitable for thin chambers due to structural limitations.
Innovation Solution
A straight-through structure comprising two plate bodies with recesses and perforations that maintain a vacuumed and airtight chamber through a hydrophilic layer and capillary structure, eliminating the need for copper columns and enhancing structural strength, applicable to both thick and thin vapor chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper columns are disposed in adjacency to the section of the vapor chamber that is attached to the heat generation component, then the tightness is enhanced to avoid thermal resistance, but the closed chamber is damaged to lose its airtightness
Solution Approach 1:
The invention extracts the copper columns from the closed chamber interior and relocates them to the exterior, where they pass through perforations in the vapor chamber wall without compromising the sealed environment. This allows the copper columns to provide mechanical support and thermal conduction while the closed chamber maintains its airtight integrity for vapor containment.
Solution Approach 2:
The invention introduces an intermediary structure where copper columns pass through perforations in the vapor chamber wall rather than being directly embedded in the closed chamber. This intermediary arrangement allows thermal and mechanical coupling while preserving the sealed vapor environment through proper sealing at the perforation interfaces.
2Length of stationary object
If the vapor chamber is made ultra-thin with total thickness under 0.8 mm, then the heat dissipation efficiency is improved, but it becomes impossible to additionally place any support column in the ultra-thin vapor chamber
Solution Approach 1:
The invention transitions the support structure from a three-dimensional internal column placement to a two-dimensional external arrangement where copper columns are positioned on the exterior surface and pass through perforations. This dimensional change allows support functionality to be achieved without occupying internal space in the ultra-thin vapor chamber.
Solution Approach 2:
The invention employs thin-walled vapor chamber construction with exterior-mounted copper columns that pass through perforations in the thin walls. This approach allows the vapor chamber to maintain its ultra-thin profile while the exterior copper columns provide necessary structural support and thermal conduction without requiring internal reinforcement.
3Length of stationary object
If copper columns are used in ultra-thin vapor chamber, then the copper columns must have extremely thin thickness, but it is hard to place in the copper columns and locate the copper columns
Solution Approach 1:
The invention inverts the conventional approach by placing copper columns on the exterior of the vapor chamber rather than embedding them internally. This reversal allows the use of standard-thickness copper columns that are easier to manufacture and install, while the vapor chamber wall itself serves as the mounting substrate through perforated connections.
4Ease of manufacture
If the conventional vapor chamber is punched and perforated, then the recessed section is connected with the lower plate, but the connection sections are free from the capillary structure which will affect the heat transfer performance
Solution Approach 1:
The invention applies local quality by ensuring that capillary structures are selectively positioned in regions where they are needed for heat transfer, while allowing perforations to be located in areas where structural connection is required. This localized differentiation maintains heat transfer performance in critical areas while enabling manufacturing connections in appropriate locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures the chamber remains vacuumed and airtight during perforation, improving thermal performance and structural integrity, particularly in ultra-thin designs, while maintaining efficient heat transfer.
Implementation Method 1
A capillary structure layer is disposed on the third face of the second plate body in the closed chamber
Implementation Method 2
A hydrophilic layer is disposed on the surface of the first face of the first plate body
Implementation Method 3
The vapor chamber can be used in a narrow space... the working fluid contained in the chamber may be interrupted
Data Source
AI summary
A straight-through structure of heat dissipation unit includes a first plate body and a second plate body correspondingly mated with each other to define a closed chamber. A hydrophilic layer is disposed on the surface of the closed chamber and a capillary structure is disposed in the closed chamber. The first plate body is formed with a first recess, a first perforation and a second recess. The first recess is connected with the capillary structure disposed on the third face of the second plate body. One end of the second recess abuts against the capillary structure. The capillary structure layer is not in contact with the first recess. The second plate body has a second perforation in alignment with the first perforation. When it is necessary to perforate the heat dissipation unit, the straight-through structure can keep the closed chamber in the vacuumed and airtight state.